LAM 810-091934-00

Product Name: LAM Research 810-091934-00 — RF Bias Power Supply (300 mm, 13.56 MHz, 4000 W) Product Overview: A high-frequency RF bias power supply for LAM 300 mm etch chambers, providing independent control of ion bombardment energy at the wafer surface.

LAM 810-099175-012

Product Name: LAM Research 810-099175-012 — Edge Ring / Wafer Guard Ring (300 mm, Silicon) Product Overview: A silicon edge ring (wafer guard ring) used on LAM 300 mm electrostatic chucks to protect the wafer edge from plasma exposure and reduce edge bevel during etch processes.

LAM 810-102361-222

Product Name: LAM 810-102361-222 — RF Match Network Assembly Product Overview: High-frequency RF match network module used in semiconductor plasma etch and deposition equipment. The unit provides impedance matching between the RF generator and the process chamber to maximize power transfer efficiency.

LAM 810-225420-002

Product Name: LAM 810-225420-002 — Electrostatic Chuck (ESC) Assembly Product Overview: Clamped-type electrostatic chuck designed for 200 mm and 300 mm semiconductor wafer clamping during plasma etch processes. Provides uniform clamping force and backside helium cooling.

LAM 810-234640-312

Product Name: LAM 810-234640-312 — RF Generator (2 MHz) Product Overview: Solid-state RF power generator operating at 2 MHz, designed for high-density plasma etch and PECVD applications. Delivers stable, precisely controlled RF power with fast turn-on/turn-off capability.

LAM 810-520659-001

Product Name: LAM 810-520659-001 — Throttle Valve Assembly Product Overview: Pneumatically actuated throttle valve for precise control of process gas flow in LAM etch and deposition chambers. Provides fast, repeatable position control for pressure regulation.

LAM 810-800081-022

Product Name: LAM 810-800081-022 — Showerhead Electrode Assembly Product Overview: Gas distribution showerhead with integrated RF electrode for uniform plasma generation across the wafer surface. Used in high-density plasma etch and PECVD processes.

LAM 810-800082-043

Product Name: LAM 810-800082-043 — Vacuum Robot Blade Assembly Product Overview: End-effector blade for the wafer transfer robot used in LAM etch and deposition chambers. The blade is the component that physically contacts and supports the wafer during transfer.

LAM 810-801237-021

Product Name: LAM 810-801237-021 — Upper Electrode Assembly (Plasma Source) Product Overview: Upper RF electrode serving as the plasma source electrode in capacitively coupled plasma (CCP) etch chambers. Designed for high-density plasma generation with controlled ion energy distribution.

LAM 810-810202-013

Product Name: LAM 810-810202-013 — Low-Pressure Chamber Liner Kit Product Overview: Replaceable interior liner kit for the process chamber, providing a clean, plasma-resistant surface that protects the chamber body from erosion and contamination.

LAM 810‑017034‑005

Product Name: VME CPU Processor Board Assembly Product Description: VME‑bus central processing unit PCB assembly for Lam Research semiconductor equipment Envision control system. It serves as local main computing unit for tool subsystem, executing equipment real‑time control logic, recipe parsing, sensor‑data processing and internal bus communication tasksRUNSHENG

LAM 810‑073479‑215

Product Name: System Interface & Signal Distribution PCB Assembly Product Description: Custom‑designed interface circuit board for Lam Research semiconductor equipment JTS / Optimus platform. It acts as signal cross‑connect hub, distributing analog and digital signals between main controller, gas box units, sensor modules and actuator sub‑systems, completing signal buffering, isolation and routing functionsRUNSHENG