B&R ECCP70-01

Technical Specifications

• Memory: 42 KByte SRAM for instruction storage
• Communication interfaces: 1 TTY interface with electrically isolated receiver, 1 configurable RS485/RS232/TTY interface
• RS485 interface: Electrically isolated, network-capable
• RS232 interface: Non-isolated
• Power supply: 24 V DC
• Power consumption: 0.88 W
• Operating temperature: -25°C to +70°C
• Protection rating: IP20
• Compatible racks: MULTI series, MIDI series module racks
• Programming: Supported via B&R configuration software

Functional Features

• Built-in MC68040 processor with floating-point unit for complex arithmetic operations
• Supports multiple communication protocols for system integration
• Network-capable RS485 interface for multi-device communication topologies
• Online programming and monitoring capability via TTY interface
• Modular design compatible with standard MULTI series I/O modules
• Comprehensive diagnostic functions for system fault detection

Application Scenarios

• Standalone machine control in textile and printing machinery
• Small-scale process control systems
• Distributed I/O network master controllers
• Retrofit and upgrade of legacy industrial control systems
• Special-purpose automation equipment with multi-protocol communication requirements

Working Principle

The module executes user control programs stored in memory, processing input data from connected I/O modules according to programmed logic. Its internal processor handles arithmetic operations, logic judgment, and communication protocol processing. It exchanges data with I/O modules via the backplane bus, and communicates with upper-level systems or other devices through serial communication interfaces. It also performs self-diagnostic routines to monitor internal hardware and communication status.

Installation Requirements

• Install in the designated CPU slot of MULTI or MIDI series racks
• Ensure proper seating of backplane connectors
• Use shielded cables for all communication connections
• Connect protective earth terminal to system ground
• Install in a ventilated control cabinet with ambient temperature within rated range
• Ensure adequate space for cable connection at front panel

Usage Notes

• Application memory PROM must be ordered separately and programmed before use
• Communication interface configuration must match connected device parameters
• Do not hot-swap the CPU module while system power is active
• Program backup should be performed before any firmware or configuration updates
• Avoid electrostatic discharge when handling the module
• Regularly check communication cable connections for reliability