LAM 810-066590-004

Product Name: LAM Research 810-066590-004 — Focus Ring Assembly (300 mm)

Product Overview: A replaceable focus ring used in LAM etch chambers to control plasma density distribution at the wafer edge, improving etch uniformity and reducing edge non-uniformity.

Category:
Description

Technical Specifications:

  • Type: Silicon Focus Ring
  • Diameter: 300 mm
  • Material: Silicon (Si) or Silicon Carbide (SiC)
  • Thickness: 8 ~ 15 mm (varies by process)
  • Hardness: Si: 7 GPa / SiC: 28 GPa (Mohs ~9.5)
  • Operating Temperature: Up to 400°C

Functional Features:

  • Plasma confinement at wafer periphery to improve etch rate uniformity
  • Consumable design — replaced on a scheduled basis (typically every 2,000–5,000 wafers)
  • Reduces edge bevel and notch effects during anisotropic etching

Performance Parameters:

Parameter Value
Diameter 300 mm ± 0.5 mm
Erosion Rate (Si) 0.5 ~ 2.0 µm/hr (process dependent)
Erosion Rate (SiC) 0.05 ~ 0.3 µm/hr
Lifespan (Si) 2,000 ~ 5,000 wafers
Lifespan (SiC) 10,000 ~ 30,000 wafers

Material Composition:

  • Standard: High-purity Monocrystalline Silicon (99.9999%)
  • Premium: Silicon Carbide (SiC) for extended life

Structural Features:

  • Ring-shaped with flat top surface
  • May include groove or step profile for specific chamber compatibility
  • Surface finish: Ra < 0.5 µm

Working Principle: The focus ring sits concentrically around the wafer on the ESC. It modifies the electric field and plasma density at the wafer edge, confining the plasma and ensuring uniform ion bombardment across the entire wafer surface, including the edge region.

Advantages:

  • Significantly improves within-wafer uniformity (WIWNU < 3%)
  • SiC variant offers 5–10× longer life than Si
  • Easy replacement — no chamber vent required in most cases

Applicable Industries: Semiconductor — Si Etch, SiO₂ Etch, Metal Etch, High-Aspect-Ratio (HAR) Etch

Model Series: LAM 810-066xxx Series — 300 mm Focus Ring

Installation Requirements:

  • Place on ESC surrounding the wafer area
  • Ensure concentric alignment with wafer center
  • No gas or electrical connections required

Usage Notes:

  • Inspect for cracking or chipping before each installation
  • Replace when erosion depth exceeds 2 mm (Si) or 0.5 mm (SiC)
  • Store in clean, dry environment to prevent contamination
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