LAM 810-072906-005

Product Name: LAM Research 810-072906-005 — RF Matching Network (300 mm, 2 MHz/13.56 MHz)

Product Overview: An automatic RF impedance matching network for dual-frequency LAM etch chambers, ensuring maximum power transfer from the RF generator to the plasma load.

Category:
Description

Technical Specifications:

  • Type: Automatic RF Matching Network
  • Frequency Range: 2 MHz + 13.56 MHz (dual)
  • Power Rating: 0 ~ 5000 W (2 MHz) / 0 ~ 3000 W (13.56 MHz)
  • Impedance Range: 5 ~ 2000 Ω (automatic tuning)
  • Tuning Speed: < 100 ms (full sweep)
  • VSWR: < 1.1:1 (at match)

Functional Features:

  • Automatic impedance matching — continuously adjusts to maintain optimal power transfer as plasma load changes
  • Dual-frequency independent tuning — 2 MHz and 13.56 MHz tuned separately
  • Fault protection — shuts down RF if VSWR exceeds 3:1

Performance Parameters:

Parameter Value
Tuning Range 5 ~ 2000 Ω
Tuning Speed < 100 ms
Power Capacity (2 MHz) 5000 W
Power Capacity (13.56 MHz) 3000 W
Reliability > 100,000 tuning cycles
Cooling Water-cooled (18°C inlet)

Material Composition:

  • Capacitors: Vacuum variable capacitors (Cu electrodes, ceramic dielectric)
  • Inductors: Air-core copper coils with ferrite cores
  • Housing: 304 Stainless Steel
  • Connectors: 50 Ω coaxial (BNC or 7/16 DIN)

Structural Features:

  • Rack-mountable 19-inch chassis (2U height)
  • Front panel with LCD status display
  • Remote control interface (RS-232 / Ethernet)

Working Principle: Uses a PI-network topology with variable capacitors and inductors. The controller continuously monitors forward/reflected power and adjusts the L and C values to minimize VSWR, ensuring maximum RF power is delivered to the plasma load.

Advantages:

  • Maintains >95% power transfer efficiency under all process conditions
  • Fast response to plasma load transients (< 100 ms)
  • Dual-frequency independence enables decoupled process control

Applicable Industries: Semiconductor — All dual-frequency plasma etch and deposition systems

Model Series: LAM 810-072xxx Series — 300 mm Dual-Freq Matching Network

Installation Requirements:

  • Mount in 19-inch rack near RF generator
  • Connect 50 Ω RF lines from generator to matching network input
  • Connect matching network output to chamber via 50 Ω coaxial cable (max 3 m)
  • Connect water cooling line (18°C, 2 L/min)
  • Connect RS-232/Ethernet for remote control

Usage Notes:

  • Calibrate every 6 months using RF power meter
  • Replace vacuum capacitors every 50,000 wafers
  • Do not operate with cooling water off — thermal shutdown at 60°C
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