LAM 810-069751-114

Technical Specifications:

• Type: Chamber Liner Replacement Kit
• Chamber Compatibility: LAM Flex, Kiyo, SPE, Vector Series (300 mm)
• Number of Pieces: 12 ~ 20 pieces per kit (varies by chamber model)
• Material: Y₂O₃-coated Aluminum, Quartz, Silicon
• Operating Temperature: Up to 350°C

Functional Features:

• Full chamber protection — prevents plasma erosion of chamber walls
• Particle trap design — captures sputtered material before it reaches wafer
• Grounding strap integration — maintains RF ground integrity

Performance Parameters:

Material Composition:

• Liner Panels: 6061-T6 Aluminum + Y₂O₃ coating
• Shield Pieces: Quartz (SiO₂) or Silicon
• Grounding Straps: Beryllium Copper (BeCu) with Au plating
• Fasteners: 316L Stainless Steel with Al₂O₃ coating

Structural Features:

• Modular design — individual panels replaceable
• Interlocking geometry for precise fitment
• Grounding tabs at each panel joint

Working Principle: The liner kit forms a protective barrier between the plasma and the chamber’s metal walls. It absorbs ion bombardment, prevents metal contamination, and maintains the electrical ground reference for stable RF operation.

Advantages:

• Extends chamber uptime — full kit replacement in < 4 hours
• Reduces particle defects by >80% vs. worn liners
• Standardized kit — no custom ordering required

Applicable Industries: Semiconductor — All 300 mm plasma etch applications

Model Series: LAM 810-069xxx Series — 300 mm Chamber Liner Kit

Installation Requirements:

• Install during scheduled PM (Preventive Maintenance)
• Torque all fasteners to 2.5 N·m (spec sheet provided)
• Verify all grounding straps are electrically continuous (< 0.1 Ω)
• Perform seasoning run (100 wafers) before production

Usage Notes:

• Replace full kit when any single panel erosion exceeds 3 mm
• Do not mix new and old liner pieces in the same chamber
• Store in humidity-controlled environment (< 40% RH)