Others

Product Name: LAM 810-102361-222 — RF Match Network Assembly Product Overview: High-frequency RF match network module used in semiconductor plasma etch and deposition equipment. The unit provides impedance matching between the RF generator and the process chamber to maximize power transfer efficiency.

Product Name: LAM 810-225420-002 — Electrostatic Chuck (ESC) Assembly Product Overview: Clamped-type electrostatic chuck designed for 200 mm and 300 mm semiconductor wafer clamping during plasma etch processes. Provides uniform clamping force and backside helium cooling.

Product Name: LAM 810-800081-022 — Showerhead Electrode Assembly Product Overview: Gas distribution showerhead with integrated RF electrode for uniform plasma generation across the wafer surface. Used in high-density plasma etch and PECVD processes.

Product Name: LAM 810-800082-043 — Vacuum Robot Blade Assembly Product Overview: End-effector blade for the wafer transfer robot used in LAM etch and deposition chambers. The blade is the component that physically contacts and supports the wafer during transfer.

Model Series: 853 Series — 853 Etch System Component Family Product Introduction: This part is a precision-machined sub-assembly used within Lam Research 853 series plasma etch chambers. It functions as an internal RF-powered electrode or gas distribution showerhead assembly that directly interfaces with the plasma generation zone. The component ensures uniform gas dispersion and controlled ion bombardment across the wafer surface during dielectric or polysilicon etch processes.