LAM 810-810202-013

Technical Specifications:

• Chamber Compatibility: LAM Kiyo® / Flex® / Spectra® series
• Liner Material: Yttria (Y₂O₃) coated Aluminum or bare Aluminum
• Thickness: 3 mm – 10 mm
• Number of Pieces: 6 – 12 per kit (top, bottom, side walls, dome)
• Lifespan: 500,000 – 2,000,000 wafers (depending on chemistry)

Functional Features:

• Y₂O₃ coating reduces fluorine-based plasma erosion by 10× vs. bare Al
• Modular design allows individual piece replacement
• Ground joints ensure RF continuity and vacuum seal integrity
• Gas distribution channels machined into liner surface

Performance Parameters:

Material Composition:

• Base: Aluminum 6061-T6, anodized
• Coating: Yttria (Y₂O₃), plasma-sprayed, 200–500 μm thick
• Fasteners: Aluminum or Stainless Steel 316L

Structural Features:

• Segmented design: ceiling, dome, sidewall, floor, gas ring
• Tongue-and-groove joints with aluminum gaskets
• Lift-pin access holes

Working Principle:
The liner forms the interior plasma-facing surface of the chamber. Process plasma contacts the liner instead of the chamber body, absorbing the erosive energy. The Y₂O₃ coating has a much lower chemical reactivity with fluorine radicals than aluminum, dramatically extending service life.

Key Advantages:

• Y₂O₃ coating extends liner life 10× compared to uncoated aluminum
• Modular kit reduces chamber downtime — only worn sections need replacement
• Consistent surface condition ensures process repeatability

Applicable Industries: Semiconductor etch (all chemistries: Cl₂, HBr, SF₆, CF₄)

Installation Requirements:

• Install in ISO Class 4 or better cleanroom
• Torque all fasteners to specification (typically 5 N·m)
• Bake chamber at 120°C for 4 hours after installation to reduce outgassing

Usage Notes:

• Measure liner thickness with ultrasonic gauge every 100,000 wafers
• Replace liner when thickness reduces by > 30% from original
• Clean liner with DI water and isopropanol; do not use abrasive materials