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LAM 810-225420-002
LAM 810-225420-002

LAM 810-102361-222

Product Name: LAM 810-102361-222 — RF Match Network Assembly

Product Overview:
High-frequency RF match network module used in semiconductor plasma etch and deposition equipment. The unit provides impedance matching between the RF generator and the process chamber to maximize power transfer efficiency.

Category:
Description

Technical Specifications:

  • Frequency Range: 2 MHz – 60 MHz
  • Power Rating: Up to 5000 W continuous
  • Impedance: 50 Ω nominal
  • VSWR: ≤ 1.2:1 at rated power
  • Cooling: Water-cooled, closed-loop deionized water
  • Connector Type: 7/16 DIN or EIA flange (customer-configured)

Functional Features:

  • Automatic impedance matching via variable capacitor array
  • Real-time VSWR monitoring and feedback loop
  • Arc detection and fast shutdown protection
  • Digital control interface via RS-485 / EtherCAT

Performance Parameters:

Parameter Value
Matching Range 2 Ω – 200 Ω
Tuning Speed < 10 ms
Reliability (MTBF) > 50,000 hours
Operating Temperature 10°C – 45°C

Material Composition:

  • Housing: Anodized Aluminum 6061-T6
  • Capacitor Plates: Oxygen-Free High-Conductivity (OFHC) Copper
  • Dielectric: Alumina Ceramic (Al₂O₃, 99.5% purity)
  • Seals: Viton® FKM O-rings

Structural Features:

  • Compact modular design, rack-mountable in 19″ cabinet
  • RF shielding enclosure with EMI gaskets
  • Quick-disconnect cooling fittings

Working Principle:
A variable vacuum capacitor array adjusts capacitance in real time to cancel reactive components of the load impedance. A digital controller continuously measures forward/reflected power and drives stepper motors to reposition capacitor plates until VSWR is minimized.

Key Advantages:

  • > 98% power transfer efficiency at full rated power
  • Fully automatic tuning eliminates operator intervention
  • Robust arc detection prevents chamber damage

Applicable Industries: Semiconductor manufacturing, MEMS fabrication, LED production

Installation Requirements:

  • Mount in climate-controlled equipment room
  • Deionized water supply: resistivity ≥ 18 MΩ·cm, flow rate ≥ 2 L/min
  • Grounding: single-point earth ground, resistance < 0.5 Ω

Usage Notes:

  • Replace cooling water every 6 months or when resistivity drops below 15 MΩ·cm
  • Inspect capacitor plates annually for arcing erosion
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