Shop

Product Name: Semiconductor Equipment Analog Signal Interface Module Product Brief: Applied Materials signal conditioning I/O module, converts low‑level field sensor analogue signals into digital bus‑compatible signals for cluster tool process monitoring and closed‑loop process control inside semiconductor fabrication tools.

Product Name: Semiconductor Tool Power Distribution Interface Module Product Brief: Applied Materials custom power‑distribution interface board for semiconductor cluster processing‑tools, distributes and switches multiple DC‑power rails for vacuum‑chamber peripheral subsystems, provides circuit‑over‑current‑protection and fault‑diagnostic‑feedback to tool host‑controller.

Product Name: CPCI-3720CF Single Board Computer (Semiconductor Manufacturing Control Board) Product Introduction: The AMAT 0190-24007 is a high-performance compact PCI single-board computer manufactured by Applied Materials (MKS-TENTA). It serves as the core control unit for 300mm wafer production lines, executing complex mathematical models to maintain precise balance between chemical gas, plasma, and mechanical polishing processes in semiconductor manufacturing.

Product Series: Applied Materials Centura / Producer PECVD & Etch Systems Product Introduction: The 0190-26873 is an RF impedance match network used in Applied Materials plasma etch and PECVD chambers. It matches the 50 Ω output of the RF generator to the variable impedance of the plasma load, maximizing power transfer and minimizing reflected power.

Product Series: Applied Materials Centura / Producer Etch Systems Product Introduction: The 0190-37519 is a replaceable chamber liner/shield ring used in AMAT plasma etch chambers. It protects the chamber walls from plasma erosion and deposits, and defines the plasma boundary for process uniformity.

Product Series: Applied Materials Centura / Producer Etch Systems Product Introduction: The 0190-37684 is a pneumatic throttle valve used in AMAT semiconductor process chambers. It controls the chamber pressure by adjusting the conductance between the chamber and the throttle pump, enabling precise pressure control from 1 mTorr to 100 Torr.