AMAT 0100‑71304

Technical Specifications

• Supply Input: 24 VDC
• Analogue Input Channels: 8 differential analogue input channels
• Input Signal Range: 0‑10 V, 4‑20 mA configurable per channel
• Conversion Resolution: 16‑bit analogue‑to‑digital conversion
• Communication Interface: Internal tool back‑plane high‑speed parallel bus
• Operating Temperature: 5 °C ~ +55 °C
• Weight: 0.53 kg Function Features
• Channel‑by‑channel configurable input type for pressure, temperature and flow transmitters
• Built‑in analogue input surge and ESD protection for noisy semiconductor tool environment
• On‑board channel fault detection for open‑loop sensor wiring
• Clean‑room compatible low‑outgassing component construction
• Real‑time measured value transfer to tool main process controller Application Scenarios: Semiconductor PVD, CVD and etch cluster processing tools; vacuum pressure transducer signal acquisition; gas mass‑flow controller monitoring; chamber temperature sensor signal conditioning. Performance Parameters: Conversion sampling rate 1 kHz aggregate; measurement accuracy ±0.1 % full scale; channel‑to‑channel crosstalk suppression >60 dB. Material Composition: Low‑outgassing FR‑4 circuit substrate; gold‑plated back‑plane connectors; surface‑mount precision resistors and isolation components; flame‑retardant plastic module housing. Structural Characteristics: Plug‑in card module for instrument rack; front‑panel status LED array; rear edge‑connector for back‑plane communication. Working Principle: Field analogue sensor signals enter channel conditioning circuits; analogue‑digital converter samples each input channel; digital data packets are transmitted over internal tool back‑plane to host process controller for process‑loop calculation and fault judgement. Installation Requirements: Mount within climate‑controlled tool electronics rack; maintain airflow clearance; strictly observe channel polarity for differential analogue inputs; use shielded twisted‑pair field sensor wiring. Usage Notes: No hot‑swap operation under power; verify signal range configuration before applying field sensor signals; prevent mechanical stress on front‑field wiring terminals.