NI CRI0-9073

Technical Specifications

• Integrated Core Architecture: Dual-Core Real-Time Processor + Xilinx Reconfigurable FPGA
• Built-In C Series I/O Slots: 8 integrated hot-swappable C Series module slots
• Real-Time Processor: Dual-Core ARM Cortex-A9, 1 GHz core frequency
• Onboard Memory: 1 GB DDR3 RAM, 4 GB industrial embedded Flash storage
• Front Panel Standard Interfaces: 2 × Gigabit Ethernet RJ45, 1 × USB 2.0 Host, 1 × RS-232 Serial Port
• FPGA Logic Resource: 28,000 programmable logic cells, 3.8 Mb block RAM
• Power Supply Input: 9 V DC – 30 V DC wide-range industrial DC power, max power consumption 26 W
• Mechanical Form Factor: Compact integrated sealed metal enclosure, desktop/DIN rail dual mounting support
• Bus Standard: NI CompactRIO internal high-speed LVDS FPGA backplane bus

Performance Parameters

• Deterministic Control Loop Latency: < 1 μs FPGA hardware loop response
• Maximum I/O Synchronization Accuracy: 20 ns channel-to-channel synchronous sampling precision
• Ethernet Bidirectional Throughput: 1 Gbps full-duplex per network port
• FPGA Parallel Signal Processing Bandwidth: 800 MB/s internal bus throughput
• Operating Vibration Resistance: 2.5 Grms (10–1000 Hz continuous vibration)
• Operating Shock Resistance: 40 g peak instantaneous impact shock
• Operating Temperature Range: -40 °C to +70 °C

Material Composition

• Outer Enclosure: One-piece extruded 6063 aluminum alloy shell, black hard anodized anti-corrosion surface treatment
• Internal PCB Stack: 10-layer high-Tg FR-4 industrial printed circuit board, analog-digital separated shielding layers
• Heat Conduction Structure: Integrated internal aluminum heat conduction frame connected to outer enclosure for passive heat dissipation
• Connector Components: Gold-plated Ethernet, USB and serial port connectors, gold-plated C Series I/O slot edge contacts
• Mounting Hardware: Stainless steel DIN rail clips and wall-mount fixing bolts
• Internal Storage: Wide-temperature industrial SLC Flash memory chip soldered on mainboard

Structural Features

• All-in-one integrated structure without separate controller chassis; 8 built-in C Series module slots support mixed analog input, analog output, digital I/O and relay modules
• Fanless full conduction cooling architecture; all heat generated by processor and FPGA transfers to external aluminum shell via internal heat frame
• Dual independent Ethernet ports support redundant network communication or separate control/data transmission network isolation
• Full hot-swap support for all 8 C Series I/O modules; module replacement without shutting down the whole controller power supply
• Dual installation structure: standard 35 mm DIN rail snap-on mounting and wall bolt fixing mounting holes reserved on enclosure
• Fully isolated internal power domain between real-time processor, FPGA core and field I/O channels to eliminate ground loop interference
• Front panel LED indicator array for power, running status, hardware fault, network link and FPGA programming state

Working Principle

1. Wide-range 9–30 V DC industrial power input enters multi-stage isolated power regulation circuit inside the enclosure, providing independent stable voltage for real-time processor, FPGA chip and each C Series I/O slot.
2. Real-time dual-core processor executes high-level industrial control logic, data logging, upper computer communication and fault diagnosis tasks under NI Linux Real-Time operating system.
3. Xilinx FPGA chip undertakes low-latency hardware-level parallel signal acquisition, pulse counting, PWM signal generation and high-speed closed-loop control algorithms; realizes nanosecond-level synchronous sampling of all I/O channels via internal LVDS backplane bus.
4. Plugged C Series I/O modules directly connect with FPGA bus to collect field sensor analog/digital signals and output control drive signals to on-site actuators.
5. Dual Gigabit Ethernet ports transmit real-time process data, alarm information and historical trend logs to external PLC, SCADA, HMI or upper monitoring industrial computer, supporting IP redundancy failover transmission.
6. Native compatibility with NI LabVIEW FPGA development environment; users compile customized hardware logic and download to FPGA chip to realize dedicated high-speed measurement and control functions.

Core Function Features

1. Integrated dual-core real-time processor + reconfigurable FPGA hybrid architecture balancing high-level logic operation and ultra-low latency hardware control
2. 8 built-in universal C Series I/O slots supporting arbitrary combination of voltage, current, thermocouple, strain, digital relay and counter modules
3. Fanless passive conduction cooling design suitable for sealed cabinet, outdoor and dust-free explosion-proof control environments
4. Dual redundant Gigabit Ethernet ports for fault-tolerant industrial network architecture
5. Full hot-swap function of I/O modules to maintain uninterrupted system operation during single-channel module maintenance
6. Wide temperature operating range -40 °C ~ +70 °C adapting extreme cold and high-temperature industrial sites
7. Deterministic microsecond-level control loop for high-precision motion control, vibration monitoring and power grid signal acquisition applications
8. Native complete driver and development tool chain matching LabVIEW, LabVIEW Real-Time and LabVIEW FPGA software platform

Advantage Highlights

1. Integrated all-in-one design reduces system assembly steps, eliminates extra backplane chassis procurement cost and cabinet space occupation
2. FPGA hardware parallel processing achieves far lower control latency than traditional software PLC, suitable for high-speed dynamic signal testing
3. Wide 9–30 V DC power input range adapts unstable industrial on-site power supply without additional voltage stabilizing modules
4. Mixed multi-type I/O module compatible slots realize flexible customization of measurement and control channel configuration according to project demands
5. Ultra-wide temperature and high vibration resistance meet vehicle-mounted, wind power, mining and offshore platform harsh working conditions
6. Redundant dual Ethernet architecture avoids single network cable breakage leading to system communication failure
7. SLC industrial Flash storage provides long-term stable data recording without mechanical hard disk failure risk

Applicable Industries

Installation Requirements

1. Two optional installation modes: snap onto standard 35 mm DIN rail, or fix to flat metal wall via reserved bolt holes on enclosure
2. Reserve minimum 15 mm clearance on all four sides of aluminum enclosure to guarantee heat conduction and heat dissipation efficiency
3. Install controller vertically; avoid horizontal upside-down placement to prevent internal heat accumulation at local position
4. Separate Ethernet communication cables and field high-current power cables with isolation distance above 10 cm to suppress electromagnetic interference
5. Connect enclosure metal shell to cabinet protective earth terminal via 2.5 mm² copper grounding wire
6. Supply DC power source with ripple voltage less than 100 mV peak-to-peak to avoid signal sampling noise interference

Operation & Maintenance Precautions

1. Wear ESD anti-static wrist strap when plugging/unplugging C Series I/O modules or connecting internal wiring
2. Do not cover aluminum enclosure surface with heat-insulating materials such as foam, plastic film, etc., which will block passive heat dissipation
3. When hot-swapping C Series modules, confirm the module lock buckle pops completely to prevent pin bending and short circuit damage
4. Regularly wipe aluminum shell dust every 3 months in dusty factories to maintain heat conduction performance
5. Firmware and FPGA logic program upgrades must adopt official NI dedicated engineering software; third-party tools are prohibited
6. Do not disassemble integrated aluminum enclosure without factory authorization, disassembly will void hardware warranty and calibration certification
7. Avoid installing near high-power frequency converters and contactors; additional metal shielding plate is required if installation position cannot be adjusted