NI CPCI-3840

Model Series

Technical Specifications

• Form Factor: 3U Eurocard, 4HP width
• Bus Standard: PICMG 2.0 / PICMG 2.1 CompactPCI
• Processor Base: Intel Core 2 Duo Dual-Core Embedded Processor
• Standard Memory: 1 GB DDR2 SDRAM onboard, expandable via rear transition module
• Storage Interface: 1 × SATA II port for industrial SSD/HDD
• Front Panel I/O: 2 × Gigabit Ethernet RJ45, 4 × USB 2.0, 1 × VGA video output, RS-232 serial debug port
• Backplane Expansion: Full PCI bus signal routing, support for multi-slot CompactPCI backplane cascading
• Power Input: +5 V / +12 V from CompactPCI backplane, typical power consumption 28 W
• Environmental Rating: Industrial wide temperature grade

Performance Parameters

• Processor Clock Speed: 1.33 GHz base frequency
• Max Continuous Data Throughput: 1.0 GB/s PCI bus bandwidth
• Real-Time Task Latency: < 60 μs deterministic response under RTOS
• Ethernet Throughput: 10/100/1000 Mbps full-duplex per port
• Vibration Resistance: 2 Grms (5–500 Hz operating vibration)
• Shock Resistance: 30 g peak operating shock

Material Composition

• Front Panel: 6061-T6 aluminum alloy, hard anodized black anti-corrosion coating
• PCB Substrate: FR-4 high-Tg industrial printed circuit board, 12-layer signal isolation stackup
• Heat Sink: Extruded aluminum fin passive heat dissipation block
• Connector Hardware: Gold-plated CompactPCI J2/P2 backplane connectors, tin-plated front panel I/O terminals
• Locking Mechanism: Stainless steel ejector lever with anti-loose spring clip

Structural Features

• Standard 3U rack-mount Eurocard architecture, fully compatible with all CompactPCI 3U chassis backplanes
• Passive vertical fin heat sink fixed to CPU chip via thermal conductive silicone pad, fanless conduction cooling design
• Front panel equipped with ejector lever lock for secure hot-swap insertion/extraction
• Rear transition module expansion slot for extended analog/digital I/O signal breakout
• Multi-layer PCB with dedicated ground shielding layers to suppress electromagnetic interference

Working Principle

1. Receives stable power supply from CompactPCI backplane bus; onboard power regulation circuit converts raw bus voltage to CPU, memory and peripheral rated operating voltage.
2. Embedded dual-core processor executes user real-time control, signal analysis and data acquisition algorithms; PCI bus routes high-speed data between CPU and expansion I/O modules on the rack backplane.
3. Front panel wired I/O interfaces realize bidirectional data communication with external sensors, actuators and host monitoring equipment.
4. Passive heat sink continuously conducts CPU heat to chassis rack frame for natural heat dissipation without forced air cooling.
5. Supports Windows Embedded, Linux Real-Time and NI Real-Time OS to run deterministic industrial measurement & control applications.

Core Function Features

1. Fanless industrial passive cooling for zero-fault long-term continuous operation
2. Full CompactPCI hot-swap support, module replacement without system power cut
3. Dual independent gigabit Ethernet ports for redundant network communication
4. Multi-channel USB 2.0 peripheral expansion for cameras, data loggers and human-machine interfaces
5. VGA display output for local on-site monitoring without external host computer
6. Onboard PCI bus master DMA controller to reduce CPU load during mass data transmission
7. Complete NI LabVIEW, LabWindows/CVI software driver native support

Advantage Highlights

1. Ruggedized industrial construction tolerates high vibration in vehicle, airborne and production line environments
2. Fanless design eliminates fan failure risk, suitable for dust-free, sealed cabinet deployments
3. Native NI software ecosystem compatibility reduces test system development cycle
4. Modular rack architecture allows flexible expansion of analog input, digital output and communication daughter boards
5. Wide industrial temperature operating range eliminates extra cooling hardware cost
6. Gold-plated high-density backplane connectors guarantee stable long-term signal transmission

Applicable Industries

Installation Requirements

1. Install into standard 19-inch industrial CompactPCI rack with 3U vertical slot position
2. Ensure chassis rack frame provides unobstructed vertical heat conduction path for passive heat sink
3. Backplane must comply with PICMG 2.1 hot-swap power sequencing specification
4. Torque ejector lever lock screw to 0.8 N·m for full mechanical grounding
5. Route front panel I/O cables with minimum 5 cm bending radius to avoid connector pin damage
6. Maintain 10 mm minimum clearance between adjacent modules for heat dissipation

Operation & Maintenance Precautions

1. Strictly prohibit hot-swap operation when backplane power supply is abnormal or overvoltage
2. Store spare modules in anti-static shielding bags; wear ESD wrist strap during all disassembly & wiring operations
3. Do not operate under ambient temperature exceeding rated upper limit for continuous periods longer than 2 hours
4. Clean aluminum heat sink fins every 6 months to remove dust accumulation blocking heat conduction
5. Avoid installing in cabinet positions with direct heat radiation from power supply modules
6. Replace damaged front panel I/O connectors with factory original gold-plated spare parts only
7. Firmware upgrade must use official NI utility software to prevent boot partition corruption