NI CPCI-3840AH

Model Series

Technical Specifications

• Form Factor: 3U Eurocard, 4HP width, PICMG 2.1 CompactPCI compliant
• Processor: Intel Core i7 Embedded Dual-Core, 3.6 GHz max boost frequency
• Onboard Memory: 2 GB DDR2 industrial wide-temperature SDRAM
• Standard Storage: 512 GB industrial wide-temperature SSD soldered onboard
• Front Panel Interfaces: Dual Gigabit Ethernet, 4 × USB 3.0, VGA, RS-485 isolated serial port
• Bus Interface: Full PCI 32-bit 33 MHz CompactPCI backplane bus
• Power Consumption: Max 32 W under full load operation
• Operating Temperature Range: -40 °C to +85 °C

Performance Parameters

• Peak PCI Bus Bandwidth: 1.3 GB/s sustained data transfer
• Real-Time Interrupt Latency: < 45 μs under Linux RTOS
• Ethernet Port Switching Speed: 1 μs failover for redundant network links
• Operating Vibration Tolerance: 3.0 Grms (5–500 Hz continuous vibration)
• Operating Shock Tolerance: 50 g peak impact shock
• SSD Endurance: 10,000 full write cycles industrial storage rating

Material Composition

• Front Panel: 6061-T6 heavy-duty aluminum alloy, hard black anodizing + anti-salt-fog passivation treatment
• PCB: 14-layer high-Tg FR-4 PCB with double-sided shielding copper foil, conformal coated for humidity & dust protection
• Heat Sink: Thickened extruded aluminum alloy fin array with high thermal conductivity thermal pad
• Connectors: 24K gold-plated CompactPCI backplane pins, isolated RS-485 terminal blocks with surge suppression
• Mechanical Hardware: Stainless steel anti-corrosion ejector lever and lock fasteners

Structural Features

• Reinforced 3U Eurocard mechanical frame with additional edge support ribs for high-shock environments
• Upgraded thick passive heat sink with extended fin surface area for extreme temperature heat dissipation
• Conformal coating on all PCB circuit traces to resist condensation, dust and mild chemical vapor
• Isolated serial communication circuit separated from main CPU power domain to eliminate ground loop interference
• Soldered onboard SSD eliminates loose hard drive vibration failure risk
• Dual independent Ethernet circuits with separate power isolation for redundant network architecture

Working Principle

1. Receives regulated industrial DC power from CompactPCI backplane; multi-stage wide-temperature power regulation circuit stabilizes voltage for extreme cold/hot operating conditions.
2. High-frequency Intel Core i7 dual-core processor executes high-speed signal processing, closed-loop control and mass data logging tasks; onboard SSD stores long-term measurement data without mechanical moving parts.
3. Isolated RS-485 and dual gigabit Ethernet enable fault-tolerant communication with distributed field sensors and central monitoring servers.
4. Conformal coated PCB and reinforced heat sink maintain stable thermal and electrical performance across full -40 °C to +85 °C operating window.
5. Native compatibility with NI real-time operating systems and LabVIEW graphical development environment for customized industrial measurement logic deployment.

Core Function Features

1. Extended -40 °C to +85 °C wide temperature operating range for outdoor, vehicle and uncooled cabinet deployments
2. Soldered industrial SSD removes mechanical hard disk vibration failure points
3. Isolated RS-485 serial interface with 2 kV surge protection for field bus communication
4. Dual redundant gigabit Ethernet ports with automatic link failure detection & switchover
5. Enhanced shock and vibration resistance certified for mobile industrial equipment
6. Conformal coated PCB circuit board for anti-humidity, anti-dust and anti-corrosion performance
7. Full hot-swap CompactPCI compliance with backplane power fault detection circuit

Advantage Highlights

1. AH high-temperature grade eliminates need for cabinet heating/cooling equipment in extreme environment sites
2. Soldered solid-state storage delivers zero mechanical failure in high-vibration machinery monitoring systems
3. Isolated communication circuits suppress field ground loop noise to improve measurement signal accuracy
4. Reinforced mechanical frame meets military-grade vibration & shock testing standards
5. Full backward hardware and software compatibility with base CPCI-3840 chassis systems
6. Conformal coating extends service life in coastal, high-humidity and chemical plant environments

Applicable Industries

Installation Requirements

1. Mount within standard 19-inch CompactPCI 3U rack frame with vertical heat conduction clearance
2. Chassis rack must be constructed of conductive aluminum alloy for full heat sink thermal dissipation
3. Backplane power supply must maintain stable +5 V / +12 V output under -40 °C low-temperature startup conditions
4. Torque ejector locking screw to 1.0 N·m to ensure full mechanical grounding and vibration resistance
5. Separate communication signal wiring from high-power AC cables with minimum 15 cm isolation distance
6. Avoid direct installation adjacent to high-power heating modules to prevent localized overheating

Operation & Maintenance Precautions

1. All module handling requires ESD protection; conformal coating does not eliminate static discharge damage risk
2. Do not power cycle module repeatedly under -30 °C or lower ambient temperature to avoid power circuit thermal stress
3. Inspect heat sink fins every 3 months for dust blockage in dusty industrial environments
4. Only use factory original wide-temperature spare SSD and memory modules for replacement
5. Prevent liquid chemical splashing on front panel I/O connectors to avoid pin corrosion
6. Hot-swap operation only permitted under controlled backplane power sequencing per PICMG 2.1 standard
7. Firmware and OS image updates must use NI dedicated industrial wide-temperature compatible software packages