AMAT 0100-71275

Model Series: Centura / Endura Etch Modules Product Description: A high-purity alumina ceramic insulator ring used in AMAT plasma etch chambers. It provides electrical isolation between the RF-powered electrode and the grounded chamber wall while withstanding high thermal loads.

AMAT 0100-71278

Model Series: Centura / Producer Platforms Product Description: A variable vacuum capacitor used in the RF matching network of AMAT plasma process chambers. It enables real-time impedance matching between the RF generator and the plasma load for maximum power transfer.

AMAT 0100-71309

Model Series: Endura / Centura Etch Chambers Product Description: A replaceable chamber liner (also called chamber wall panel) that lines the interior of AMAT plasma etch chambers. It protects the chamber body from plasma erosion and chemical attack while contributing to process uniformity.

AMAT 0100-71311

Model Series: Centura / Endura PVD Modules Product Description: A pneumatically actuated throttle valve used to control chamber pressure in AMAT physical vapor deposition (PVD) and sputter systems. It regulates gas flow to maintain precise process pressure during thin-film deposition.

AMAT 0100-76124

Model Series: Centura / Producer Bias Systems Product Description: A high-voltage DC power supply module used to generate substrate bias voltage in AMAT plasma etch chambers. It provides precise DC bias control from 0V to -5000V for ion energy control during anisotropic etching.

AMAT 0100-77037

Model Series: HiPace Series Equivalent Product Description: A high-capacity turbomolecular vacuum pump used in AMAT cluster tools and standalone process chambers. It achieves high vacuum and ultra-high vacuum conditions required for sputtering, CVD, and etch processes.

AMAT 0190-07970

Product Series: Applied Materials P5000 / Centura Etch Systems Product Introduction: The 0190-07970 is a gas distribution manifold used in Applied Materials semiconductor etch and deposition chambers. It precisely routes process gases (e.g., CF₄, Cl₂, O₂, Ar, N₂) from gas cabinets to the showerhead or pedestal within the chamber.

AMAT 0190-15779

Technical Specifications
  • Control Precision: High-resolution encoder enables precise positioning and motion control with minimal error margins.
  • Torque and Inertia: Features high torque output and low inertia for rapid response to control signals, enhancing dynamic system performance.
  • Speed Range: Operates efficiently across a wide speed range, adapting to varying load conditions without compromising stability.
  • Cooling Design: Optimized cooling system ensures stable performance during prolonged high-speed operation, extending service life.
  • Construction: Built with high-quality materials and robust components to withstand harsh industrial conditions, including vibration and temperature fluctuations.

AMAT 0190-26873

Product Series: Applied Materials Centura / Producer PECVD & Etch Systems Product Introduction: The 0190-26873 is an RF impedance match network used in Applied Materials plasma etch and PECVD chambers. It matches the 50 Ω output of the RF generator to the variable impedance of the plasma load, maximizing power transfer and minimizing reflected power.

AMAT 0190-27952

Product Series: Applied Materials Centura / Producer Etch Systems Product Introduction: The 0190-27952 is a Johnson-Rahbek electrostatic chuck used to clamp semiconductor wafers during plasma etch processes. It provides uniform clamping force across the wafer surface using high-voltage DC applied between the chuck electrodes and the wafer.

AMAT 0190-30354

Product Series: Applied Materials / Brooks Instrument SLA5850 Series Product Introduction: The 0190-30354 is a thermal mass flow controller used in AMAT semiconductor process chambers. It precisely controls the flow rate of process gases (e.g., Ar, O₂, N₂, CF₄, Cl₂) with high accuracy and fast response.

AMAT 0190-37519

Product Series: Applied Materials Centura / Producer Etch Systems Product Introduction: The 0190-37519 is a replaceable chamber liner/shield ring used in AMAT plasma etch chambers. It protects the chamber walls from plasma erosion and deposits, and defines the plasma boundary for process uniformity.