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Technical Specifications – Input channels : 22 dynamic + 24 static/process channels – Sampling rate : 102.4 kHz per dynamic channel, synchronous across the rack – Resolution : 16-bit ADC, <0.02 % non-linearity, 30 ppm/°C drift – Frequency range : 0.3 Hz – 40 kHz (–3 dB) with programmable filters – On-board memory : 2 GB for transient buffer, event log and firmware – Communication ports : – 10/100BASE-TX copper Ethernet – 100BASE-FX fiber-optic Ethernet (optional) – USB-B service port – RS-232 / RS-485 Modbus RTU – Protocols : Modbus TCP/RTU, proprietary Bently protocol, OPC UA tunnel – Power draw : 24 Vdc from rack back-plane, 10.5 W typical, <15 W max – Isolation : 1 500 Vac channel-to-ground, 500 V channel-to-channel – MTBF : >250 000 h @ 45 °C per MIL-HDBK-217F – Operating temperature : –40 °C to +85 °C full performance – Storage temperature : –55 °C to +125 °C – Humidity : 5 %–95 % non-condensing – Shock / vibration : 15 g half-sine 11 ms; 5 g 5–500 Hz operational – Dimensions : 229 mm × 140 mm × 48 mm (9.0" × 5.5" × 1.9") – Weight : 1.0 kg (2.2 lb) – Agency approvals : CE, UL/cUL Class I Div 2, ATEX/IECEx Zone 2, RoHS, ABS marine

Technical Specifications – Host position : slot 1 (full-height), mandatory in every 3500 rack – Input channels : 22 dynamic + 24 static/process channels – Sampling rate : 102.4 kHz per dynamic channel, synchronous across the rack – Resolution : 16-bit ADC, <0.02 % non-linearity, 30 ppm/°C drift – Frequency range : 0.3 Hz – 40 kHz (–3 dB) with programmable high-pass, low-pass and notch filters – On-board memory : 2 GB for transient buffer, event log and firmware – Communication ports : – 10/100BASE-TX auto-negotiating copper Ethernet (RJ-45) – 100BASE-FX fiber-optic Ethernet (optional) – USB-B front service port (38.4 kbaud) – RS-232 / RS-485 (38.4 kbaud, Modbus RTU) – Protocols : Modbus TCP/RTU, proprietary Bently protocol, OPC UA tunnel – Power draw : 24 Vdc from rack back-plane, 10.5 W typical, <15 W max – Isolation : 1 500 Vac channel-to-ground, 500 V channel-to-channel – MTBF : >250 000 h @ 45 °C per MIL-HDBK-217F – Operating temperature : –40 °C to +70 °C full performance – Storage temperature : –40 °C to +85 °C – Humidity : 5 %–95 % non-condensing – Shock / vibration : 15 g half-sine 11 ms; 5 g 5–500 Hz operational – Dimensions : 229 mm × 140 mm × 48 mm (9.0" × 5.5" × 1.9") – Weight : 1.0 kg (2.2 lb) – Agency approvals : CE, UL/cUL Class I Div 2, ATEX/IECEx Zone 2, RoHS, ABS marine

Technical Specifications – Input channels : 22 dynamic + 24 static/process channels – Sampling rate : 250 kHz max per dynamic channel, synchronous across the rack – Resolution : 16-bit ADC, <0.02 % non-linearity, 30 ppm/°C drift – Frequency range : 0.3 Hz – 100 kHz (–3 dB) with programmable high-pass, low-pass and notch filters – On-board memory : 2 GB for transient buffer, event log and firmware – Communication ports : – 10/100BASE-TX auto-negotiating copper Ethernet (RJ-45) – 100BASE-FX fiber-optic Ethernet (optional) – USB-B front service port (38.4 kbaud) – RS-232 / RS-485 (38.4 kbaud, Modbus RTU) – Protocols : Modbus TCP/RTU, proprietary Bently protocol, OPC UA tunnel – Power supply : 24 Vdc from rack back-plane, 10.5 W typical, <25 W max – Isolation : 1 500 Vac channel-to-ground, 500 V channel-to-channel – MTBF : >250 000 h @ 45 °C per MIL-HDBK-217F – Operating temperature : –40 °C to +85 °C full performance – Storage temperature : –55 °C to +125 °C – Humidity : 0 %–95 % non-condensing – Shock / vibration : 15 g half-sine 11 ms; 5 g 5–500 Hz operational – Dimensions : 241 mm × 58 mm × 28 mm (9.5" × 2.3" × 1.1") – Weight : 0.91 kg (2.0 lb) for TDI module; 0.2 kg for I/O card – Enclosure / PCB : conformal-coated, IP65 gasket on Ethernet ports – Agency approvals : CE, UL/cUL Class I Div 2, ATEX/IECEx Zone 2, RoHS, ABS marine

Technical Specifications – Host position : slot 1 (full-height), mandatory in every 3500 rack – Input channels : 22 dynamic + 24 static/process channels – Sampling rate : 25.6 kHz / 51.2 kHz / 102.4 kHz selectable per dynamic channel – Resolution : 16-bit ADC, <0.02 % non-linearity, 30 ppm/°C drift – Frequency range : 0.3 Hz – 40 kHz (–3 dB) with programmable high-pass, low-pass and notch filters – On-board memory : 2 GB for transient buffer, event log and firmware – Communication ports : – 10/100BASE-TX auto-negotiating copper Ethernet (RJ-45) – 100BASE-FX fiber-optic Ethernet (optional) – USB-B front service port (38.4 kbaud) – RS-232 / RS-485 (38.4 kbaud, Modbus RTU) – Protocols : Modbus TCP/RTU, proprietary Bently protocol, OPC UA tunnel – Power draw : 24 Vdc from rack back-plane, 10.5 W typical, <15 W max – Isolation : 1 500 Vac channel-to-ground, 500 V channel-to-channel – MTBF : >250 000 h @ 45 °C per MIL-HDBK-217F – Operating temperature : –40 °C to +85 °C full performance – Storage temperature : –55 °C to +125 °C – Humidity : 5 %–95 % non-condensing – Shock / vibration : 15 g half-sine 11 ms; 5 g 5–500 Hz operational – Dimensions : 241 mm × 58 mm × 28 mm (9.5" × 2.3" × 1.1") – Weight : 0.91 kg (2.0 lb) for TDI module; 0.2 kg for I/O card – Agency approvals : CE, UL/cUL Class I Div 2, ATEX/IECEx Zone 2, RoHS, ABS marine

Technical Specifications – Module type : half-height, dual-channel, occupies one front slot – Input signal : proximity probe or magnetic pickup – Non-isolated I/O : +0.8 V to –21 V – Isolated I/O : +5 V to –11 V – Input impedance : ≥ 21.8 kΩ – Output signal : digital keyphasor pulse, buffered coax on front & Euro connector on rear – Speed range : 0 – 99 999 RPM (passive mag pickup requires >200 RPM) – Accuracy : ±0.05 % – Resolution : 0.1 RPM – Sampling rate : 1 kHz per channel – Phase shift : <1° typical (non-isolated), <3° isolated – Output impedance : ≤504 Ω – Power supply : –24 Vdc from rack back-plane, 40 mA max per channel – Power consumption : 3.2 W typical – On-board memory : 32-bit RISC processor, flash for firmware & event log – MTBF : >300 000 h @ 45 °C per MIL-HDBK-217F – Operating temperature : – Non-isolated : –30 °C to +65 °C – Isolated : 0 °C to +65 °C – Storage temperature : –40 °C to +85 °C – Humidity : 95 % RH non-condensing – Shock / vibration : 15 g 11 ms; 2 g 5 – 500 Hz operational – Dimensions : 119.9 mm × 24.4 mm × 256.5 mm – Weight : 0.34 kg (0.76 lb) – Agency approvals : CE, UL/cUL Class I Div 2, ATEX/IECEx Zone 2, RoHS, ABS marine

Technical Specifications – Module size : full-height, single-slot, front plug-in – Relay channels : 4, each DPDT (2 × SPDT) – Contact rating : 5 A @ 24 Vdc / 120 Vac (resistive) – Max switching voltage : 250 Vac / 30 Vdc – Operate time : ≤ 10 ms (typical) – Isolation : 1 500 Vrms coil-to-contact & channel-to-ground – Power draw : 5 W max (24 Vdc from rack back-plane) – MTBF : >300 000 h @ 45 °C per MIL-HDBK-217F – Operating temperature : –40 °C to +85 °C – Storage temperature : –55 °C to +100 °C – Humidity : 5 % – 95 % RH non-condensing – Shock / vibration : 15 g ½-sine 11 ms; 2 g 5-500 Hz operational – Dimensions : 177 mm × 127 mm × 70 mm (7" × 5" × 2.8") – Weight : 1.1 kg – Agency approvals : CE, UL/cUL Class I Div 2, ATEX/IECEx Zone 2, RoHS, ABS marine