Others

Product Category: Semiconductor Wafer Processing Component — Wafer Clamping Device Product Introduction: This is a ceramic-coated electrostatic chuck (ESC) used in LAM Research etch and deposition reactors. It holds wafers securely via electrostatic force during plasma processing. The ceramic coating (Al₂O₃ or AlN) provides electrical insulation and thermal conductivity for precise wafer temperature control.

Product Category: Semiconductor Wafer Processing Consumable — Chamber Liner Product Introduction: This is a silicon-coated aluminum chamber liner (shield) used in LAM Research plasma etch reactors. It protects the chamber walls from plasma erosion and provides a controlled surface for process chemistry interaction. The YSZ coating ensures long life and low particle generation.

Product Category: Semiconductor Wafer Processing Consumable — Gas Inlet Hardware Product Introduction: This is a silicon-coated gas distribution plate (GDP) used in LAM etch reactors. It sits between the shower head and the process gas inlet, ensuring even gas flow to the shower head orifices. The YSZ coating prevents corrosion from fluorine-based plasmas.

Product Name: LAM Research 810-066590-004 — Focus Ring Assembly (300 mm) Product Overview: A replaceable focus ring used in LAM etch chambers to control plasma density distribution at the wafer edge, improving etch uniformity and reducing edge non-uniformity.

Product Name: LAM Research 810-069751-114 — Chamber Liner Kit (300 mm Etch Chamber) Product Overview: A full replacement liner kit for LAM 300 mm etch chambers, including chamber wall protection, grounding straps, and consumable shield components.

Product Name: LAM Research 810-072906-005 — RF Matching Network (300 mm, 2 MHz/13.56 MHz) Product Overview: An automatic RF impedance matching network for dual-frequency LAM etch chambers, ensuring maximum power transfer from the RF generator to the plasma load.