LAM 605-108114-003

Product Category: Semiconductor Wafer Processing Consumable — Plasma Etch Chamber Component

Product Introduction:
This is a precision-machined silicon-coated aluminum shower head used in LAM Research plasma etch reactors. It delivers process gas uniformly across the wafer surface during dry etching operations. The silicon coating (YSZ — Yttria-Stabilized Zirconia) provides superior plasma erosion resistance and extends service life.

Category:
Description

Technical Specifications:

  • Part Number: 605-108114-003
  • Coating Material: Yttria-Stabilized Zirconia (YSZ), typically 8% Y₂O₃-ZrO₂
  • Coating Thickness: 150–300 μm (typ.)
  • Base Material: 6061-T6 Aluminum Alloy
  • Bore Diameter: Multiple precision orifices, 0.5–1.5 mm range
  • Surface Finish: Ra ≤ 0.8 μm (machined), Ra ≤ 1.6 μm (coated)
  • Operating Temperature: Up to 350°C continuous
  • Compatible Reactors: LAM 2300, Flex, Polygon, SPE, TEL (legacy) etch platforms

Functional Features:

  • Uniform gas distribution across 200mm/300mm wafers
  • Silicon-coated surface resists fluorine-based plasma attack
  • Precision-drilled orifice array ensures laminar flow
  • Replaceable consumable with defined service life

Performance Parameters:

  • Gas Flow Uniformity: ≤ ±3% across wafer surface
  • Plasma Erosion Rate: < 0.5 μm/hour (with YSZ coating)
  • Service Life: 80–150 process hours (depending on recipe)
  • Particle Generation: < 10 particles/cm² (post-coating)

Material Composition:

Component Material
Body 6061-T6 Aluminum
Coating 8% Yttria-Stabilized Zirconia (YSZ)
Seal Interface Anodized Aluminum or Ceramic-sealed

Structural Features:

  • Circular disc geometry with radial gas channel
  • Multi-zone orifice pattern for uniformity
  • O-ring groove for chamber seal
  • Coating applied via plasma spray (APS) process

Working Principle:
Process gas enters the shower head through a central inlet, flows through precision-machined internal channels, and exits through a uniformly distributed array of orifices onto the wafer surface. The YSZ coating acts as a barrier against reactive plasma species, preventing aluminum corrosion and particulate contamination.

Key Advantages:

  • Extended component lifetime vs. uncoated aluminum
  • Reduced particle contamination in etch process
  • Consistent etch uniformity across wafer
  • KLA-certified OEM quality

Applicable Industries:

  • Semiconductor Manufacturing (Front-End Wafer Fabrication)
  • MEMS Fabrication
  • Advanced Packaging

Installation Requirements:

  • Install in cleanroom environment (ISO Class 5 or better)
  • Torque mounting bolts to 5–7 N·m per manufacturer spec
  • Verify O-ring seating before chamber pump-down
  • Perform leak check at 10⁻⁶ Torr·L/s maximum

Usage Precautions:

  • Do not exceed 350°C operating temperature
  • Replace after defined service hours regardless of visual condition
  • Handle with ESD-safe gloves; coating is brittle under impact
  • Store in sealed, dry nitrogen-purged container
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