NI SBRIO-9607

Technical Specifications

• Processor: 667 MHz dual-core ARM Cortex-A9
• Real-Time Operating System: NI Linux Real-Time
• FPGA: Xilinx Zynq-7020 (Z-7020) with 85k logic cells and 220 DSP blocks
• System Memory: 512 MB DRAM
• Nonvolatile Storage: 512 MB
• Digital I/O Lines: 96 bidirectional digital lines
• Communication Ports: 1× Gigabit Ethernet, 1× CAN port, 1× RS-232, 2× RS-485, 2× USB 2.0
• Power Supply Range: 9 V DC to 30 V DC
• Maximum Power Consumption: 28 W
• Operating Temperature Range: -40°C to +85°C (local ambient)
• Dimensions: 155 mm × 102 mm × 22 mm

Functional Features

• Integrated real-time processor and FPGA architecture for deterministic control
• LabVIEW programmable for rapid application development
• Wide operating temperature range for extreme environments
• 15-year hardware product lifecycle support
• Built-in real-time clock (RTC) with battery backup
• RMC connector for mezzanine card expansion
• Overvoltage and reverse-polarity power protection
• Support for NI CompactRIO I/O modules via expansion

Application Scenarios

• Industrial machine control and monitoring
• Power electronics and inverter control
• Automotive test and measurement systems
• Aerospace and defense embedded systems
• Energy grid monitoring and control
• Remote environmental monitoring stations

Material & Structure

• FR-4 printed circuit board with soldered components
• Board-edge connectors for power, I/O and communication
• Integrated heat spreader for thermal management
• Surface-mount memory and processing components
• Mounting holes for chassis or panel installation
• Conformal coating option for harsh environments

Working Principle The device uses a heterogeneous processing architecture: the ARM processor runs the real-time operating system and executes application code, while the FPGA implements custom timing, I/O processing and high-speed control logic. This combination delivers ultra-low latency and deterministic performance for closed-loop control systems. The I/O interfaces connect directly to the FPGA for maximum speed and flexibility.

Installation Requirements

• Mount using four M3 screws with 5 mm minimum standoff
• Ensure adequate airflow across the board for cooling
• Use shielded cables for all I/O and communication connections
• Connect protective earth to mounting chassis for EMC compliance
• Power supply must meet SELV requirements
• Operate in pollution degree 2 environment or enclosed housing

Usage Notes

• Static discharge can damage components; use ESD protection during handling
• Do not apply voltages beyond rated I/O limits
• Ensure proper heat dissipation in high-temperature environments
• Backup application code and configuration before firmware updates
• Do not operate in condensation-prone environments without conformal coating
• Refer to NI documentation for FPGA pinout and signal definitions