Technical Specifications
- Module Form Factor: Single-wide 19-inch rack pluggable module
- Overall External Dimensions: 150 mm (W) × 240 mm (H) × 350 mm (D)
- Net Module Weight: 1.98 kg
- Full Shipping Weight: 2.9 kg
- Backplane Supply Power Consumption: Max 18 W DC 24 V
- Backplane Communication Bus Speed: 2 Mbps proprietary COS bus protocol
- Maximum Process Control Loop Count: 16 independent PID closed-loop control channels
- Analog Signal Processing Channels: 8 input / 4 output onboard signal conditioning
- Digital Discrete I/O Expansion Capacity: 64 points via rear backplane extension slots
- Operating Ambient Temperature: 0 °C to +60 °C
- Storage Temperature Band: -20 °C to +75 °C
- Relative Humidity Operating Range: 5% – 95% RH, non-condensing atmosphere
- Electrical Isolation Rating: 1500 V DC between field signal circuits and backplane bus
- Vibration Compliance: IEC 60068-2-6 industrial vibration standard
- Product Lifecycle Status: Fully discontinued, factory production terminated
Function Features
- Onboard analog signal linearisation for thermocouple, RTD, 4–20 mA industrial sensor signals
- Multi-channel independent PID closed-loop control with auto-tune algorithm for temperature, pressure, flow process regulation
- Digital logic interlock execution with 1 ms minimum scan cycle time
- Hot-swap compatible rack design for non-stop online module replacement without system shutdown
- Built-in hardware fault diagnostic LED indicators for bus communication, power supply, channel overrange and CPU failure
- Non-volatile flash memory storage for all control logic programs and process parameter setpoints
- Backplane bus data synchronisation with all rack-mounted I/O expansion modules
- Overcurrent, overvoltage and reverse polarity protection circuits for all field signal terminals
Performance Parameters
- Main control CPU scan cycle minimum: 1 ms
- Analog channel full signal update latency: 8 ms
- PID control algorithm execution precision: 16-bit digital resolution
- Non-volatile program storage capacity: 128 KB flash memory
- Maximum continuous backplane bus data throughput: 256 KB/s
- Fault diagnostic response time: < 200 μs upon hardware error detection
Material Composition
- Front panel: Grey flame-retardant ABS industrial plastic with printed status legend
- Module housing frame: Die-cast aluminum alloy with black oxidation anti-corrosion treatment
- Internal circuit boards: Multi-layer FR4 PCB with tin-lead free surface finish
- Backplane edge connector: Gold-plated copper alloy contact pins for long-term plug durability
- Signal terminal blocks: PA66 glass-filled thermoplastic with spring screw clamping mechanism
Structural Characteristics
- Horizontal plug-in rack mounting structure compatible with standard COS70 system backplane racks
- Front panel integrated status LED array and module extraction lock levers on both sides
- Internal compartment separation: Front CPU control zone, rear field signal terminal zone
- Integrated passive aluminum heat sink for power regulation circuit thermal dissipation
- Full electromagnetic shielding metal casing to suppress industrial site radio frequency interference
- Rear edge connector direct mating with rack backplane bus, no intermediate wiring adapters required
Working Principle
- Field analog and digital signals enter the module via rear terminal blocks, passing through galvanic isolation and signal conditioning circuits
- Multiplexed analog signals convert to 16-bit digital data via onboard ADC converters and transmit to central processing unit
- CPU executes preloaded PID control logic, digital interlock ladder programs and fault monitoring algorithms per fixed scan cycle
- Calculated control output values convert back to analog 4–20 mA / 0–10 V signals or digital discrete switching outputs
- Process variable data and fault diagnostic information transmit to rack backplane bus for communication with human-machine interface and other control modules
- Hardware watchdog circuit continuously monitors CPU operation; triggers system fault alarm and safe state interlock upon processing failure
Advantage Highlights
- Hot-swappable hardware design eliminates full DCS system shutdown during module maintenance
- Integrated PID auto-tune function reduces on-site commissioning calibration workload
- High channel-to-backplane isolation suppresses ground loop noise in multi-sensor process plants
- Robust aluminum frame structure withstands continuous industrial vibration on production lines
- Unified COS bus communication protocol achieves seamless data synchronisation with all series I/O modules
- Complete onboard overvoltage/overcurrent protection prevents permanent module damage from field wiring short circuits
Applicable Industries
Chemical processing plants, oil & gas refining facilities, power generation thermal plants, water treatment automation systems, pulp and paper manufacturing lines, metallurgical smelting process control, cement production distributed control systems
Installation Requirements
- Insert horizontally into standard CEGELEC COS70 series rack backplane slots, lock both side extraction levers fully seated after insertion
- Maintain minimum 30 mm vertical clearance between adjacent rack modules for passive heat sink air circulation
- Cabinet internal cooling air flow rate minimum 0.5 m/s to maintain operating temperature within rated range
- Connect all field signal shield cable screens to dedicated module chassis grounding terminal
- Rack backplane must receive regulated 24 V DC power supply with ±5% voltage stability tolerance
- Prohibit installation in cabinet zones containing corrosive gas or condensing high humidity atmosphere
Usage Notes
- The model is fully discontinued; spare unit replacement only available via surplus industrial automation stock suppliers
- Complete backup of all control programs to external storage before module removal to avoid parameter loss
- Do not perform hot swap operations during critical process production periods to prevent transient control signal disturbance
- Inspect backplane gold-plated edge connectors for oxidation before reinstallation of refurbished modules
- Avoid exceeding 60 °C continuous ambient temperature to prevent accelerated flash memory data degradation
- All field signal wiring must follow separate analog/digital cable routing to eliminate cross-talk interference
- Replace internal terminal block fuse with identical rated component only upon overcurrent protection activation
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