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Densan DVEP7447-50
Densan DVEP7447-50
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Densan JDVE-SH7604 (9271)
Densan JDVE-SH7604 (9271)

Densan DVEP7447-50A

Product Introduction
DVEP7447-50A continues the Densan 6U VME computing platform based on the MPC7447A processor. It is intended for embedded VME systems requiring Power Architecture performance, gigabit networking, serial maintenance ports, CompactFlash/IDE storage and VME-PCI bridging. Any 50A-specific changes in memory size, firmware, temperature rating, connector option or BSP must be confirmed from the official 50A ordering sheet.
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Description
Technical Specifications
Processor:​ Freescale/NXP MPC7447A Power Architecture RISC microprocessor.
Processor Cache:​ L1 32 KB, L2 512 KB, integrated MMU.
Memory:​ 512 MB DDR2 SDRAM SO-DIMM in the base DVE-P7447/50 class.
Boot Flash:​ 3.3 V PLCC IPL socket, 512 KB, 32-pin.
Application Flash:​ 64 MB application storage.
NVRAM RTC:​ 32 KB non-volatile real-time clock memory.
Ethernet:​ Two gigabit Ethernet ports.
Serial:​ Four RS-232C ports.
Storage:​ IDE interface with CompactFlash.
USB:​ USB 2.0 host.
VME Bridge:​ Universe II VME-PCI bridge.
Form Factor:​ 6U VME.
Auto ID:​ Automatic slot ID and central-resource control.
Revision Note:​ For 50A, confirm processor speed grade, DDR2 module option, flash size, operating temperature, conformal coating, rear-transition-module compatibility and firmware version with Densan.
Functional Features
System Controller Option:​ Automatic central-resource enable/disable by slot.
High-Speed Networking:​ Dual gigabit Ethernet for control, data and diagnostics.
Mixed Legacy/Modern I/O:​ Serial, USB, IDE/CF and VME cover migration from older VME installations.
Application Scenarios
VME Upgrade Projects:​ Replacement or expansion of 6U VME computing nodes.
Industrial And Test Systems:​ Real-time control, data acquisition hosting and maintenance terminals.
Long-Life Embedded Platforms:​ Transportation, defense and instrumentation deployments requiring VME continuity.
Performance Parameters
Processor Features:​ 32/64-bit Power Architecture interfaces, AltiVec vector units on compatible silicon, four integer execution units, composite integer unit, double-precision FPU, dynamic clock frequency control and on-die temperature diode.
Memory Performance:​ Determined by DDR2 speed, MPC7447A front-side bus and bridge configuration.
VME Performance:​ Constrained by VME backplane standard, Universe II translation and system controller role.
Material Composition
PCB And Components:​ Multilayer FR4, BGA processor with heatsink, DDR2 SO-DIMM, PLCC and SMT flash, NVRAM, VME edge connector and metal/plastic panel components.
RoHS Status:​ Base model is specified as PbF/lead-free; 50A procurement sheet should be checked for full compliance grade.
Structural Characteristics
6U Card:​ Processor subsystem, memory, storage, bridge and I/O laid out for VMEbackplane installation.
Heatsink Assembly:​ Direct thermal contact with MPC7447A; mechanical height must clear chassis and RTM options.
Auto-ID Logic:​ Hardware/software mechanism selects controller versus peripheral operation.
Working Principle
The MPC7447A boots from IPL flash, initializes DDR2 and NVRAM, loads the operating system or application from flash/CompactFlash/network, and runs tasks using AltiVec/FPU as required. Ethernet and serial provide operator interfaces; IDE/CF provides local storage; Universe II converts VMEbus transactions to the processor PCI/local domain; auto-ID sets system controller responsibility.
Installation Requirements
Chassis:​ 6U VME rack with compatible backplane, airflow and mechanical clearance.
Revision Check:​ Read the 50A label and compare processor speed, memory, flash and jumper options with the issued datasheet.
Memory And Storage:​ Install approved DDR2 SO-DIMM and CompactFlash; verify boot device before first power-on.
Network And Serial:​ Assign IP addresses and serial console parameters per system plan.
Cooling:​ Maintain processor and memory thermal margins; inspect heatsink attachment periodically.
Usage Precautions
Variant Control:​ Do not apply DVEP7447-50 settings to 50A without checking revision differences.
ESD And Handling:​ Use grounded handling for processor, memory and flash devices.
Firmware Lock:​ Preserve approved IPL/application images; change firmware only with validated 50A BSP.
Thermal Monitoring:​ Use processor temperature diode readings where supported and avoid sustained overload without adequate airflow.
Backplane Safety:​ Confirm VME address ranges, IRQ assignments and termination before inserting the board into an active system.
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