Technical Specifications
Processor: Freescale/NXP MPC7447A Power Architecture RISC microprocessor.
Processor Cache: On-chip L1 32 KB and L2 512 KB; memory management unit integrated in the processor.
Memory: 512 MB DDR2 SDRAM installed as SO-DIMM.
Boot Flash: IPL flash in 3.3 V PLCC socket, 512 KB, 32-pin.
Application Flash: 64 MB application flash storage.
Non-Volatile Time Data: 32 KB NVRAM real-time clock.
Ethernet: Two gigabit Ethernet ports.
Serial: Four RS-232C interfaces.
Storage Interface: IDE interface with CompactFlash support.
USB: One USB 2.0 host interface.
VME Bridge: Universe II VME-PCI bridge.
Slot Management: Automatic ID function; central-resource mode switched automatically according to slot position.
Form Factor: 6U VME board.
Functional Features
Central Resource: Can operate in all VME slots; automatic enable/disable of system controller functions.
Networking: Dual gigabit ports for host communication, debugging and data transfer.
Legacy I/O: RS-232C, IDE/CF and USB cover boot, maintenance and peripheral expansion.
VME Interconnect: Universe II bridge connects VMEbus transactions to the PCI/local processor domain.
Application Scenarios
VME System Computing: Main CPU board in 6U VME racks.
Industrial Control: Real-time data processing, logging and equipment supervision.
Test And Instrumentation: Signal processing, protocol control and long-life embedded computing.
Performance Parameters
Processor Throughput: MPC7447A provides 32/64-bit Power Architecture execution, AltiVec vector capability on compatible silicon revisions, multiple integer units and FPU; exact board operating frequency must be confirmed from the processor sticker and BSP.
Memory Bandwidth: Determined by DDR2 SO-DIMM speed, processor front-side bus and Universe II VME/PCI translation.
I/O Bandwidth: Gigabit Ethernet, USB 2.0 and IDE performance depend on installed drives, network load and operating system drivers.
Material Composition
PCB: Multilayer FR4 VME processor card.
Processor Module: MPC7447A BGA device mounted with heatsink.
Memory Devices: DDR2 SO-DIMM, PLCC boot flash, SMT application flash, battery-backed or non-volatile NVRAM.
Connectors: VME 6U edge connector plus panel RJ45, DB9/serial, USB, IDE/CF and JTAG/service interfaces as fitted.
Structural Characteristics
6U Layout: Processor, memory, flash, bridge and I/O arranged for VMEbackplane power and signaling.
Cooling Structure: Heatsink on MPC7447A; airflow path must satisfy processor and DDR2 thermal requirements.
Automatic ID Hardware: Slot identification logic controls central-resource role without manual jumper changes where supported.
Working Principle
The MPC7447A executes operating system and application code from DDR2 memory, boots from PLCC IPL flash, loads application image from 64 MB flash or CompactFlash, maintains time and configuration in NVRAM, exchanges data over gigabit Ethernet and serial ports, and communicates with the VME backplane through the Universe II bridge. The automatic ID circuit determines whether the board acts as VME system controller or peripheral board.
Installation Requirements
Chassis Compatibility: Install in a 6U VME rack with correct backplane connectors and clearance for the processor heatsink.
Slot Configuration: Allow automatic ID to set central-resource mode; if the system requires forced controller mode, follow the Densan jumper/service documentation.
Storage Preparation: Insert DDR2 SO-DIMM, CompactFlash and any optional drive before power-on; verify boot flash device type.
Cabling: Connect Ethernet, serial, USB and IDE devices only with approved cables; avoid bending VME edge contacts.
Cooling: Confirm chassis airflow matches processor power dissipation; do not block heatsink fins.
Usage Precautions
Electrostatic Protection: Handle memory, processor and flash modules with ESD grounding.
Boot Integrity: Keep a verified IPL and application image; record NVRAM configuration before replacement.
Thermal Limits: Monitor processor temperature using onboard sensors where supported; reduce load or improve cooling if thermal warnings occur.
Firmware Compatibility: Use only BSP, BIOS/IPL and OS images validated for DVEP7447-50.
VME Termination: Ensure backplane termination and address ranges do not conflict with other VME boards.
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