AMAT 0190-30354

Product Series: Applied Materials / Brooks Instrument SLA5850 Series

Product Introduction:
The 0190-30354 is a thermal mass flow controller used in AMAT semiconductor process chambers. It precisely controls the flow rate of process gases (e.g., Ar, O₂, N₂, CF₄, Cl₂) with high accuracy and fast response.

Category:
Description

Technical Specifications:

Parameter Value
Gas Type Ar / O₂ / N₂ / CF₄ / Cl₂ (gas-specific)
Flow Range 0–5000 sccm (gas-dependent)
Accuracy ±1.0% of full scale (1σ)
Repeatability ±0.2% of full scale
Response Time (t90) < 100 ms
Control Signal 0–5 V DC / 4–20 mA
Operating Pressure 1–10 Torr inlet
Output Pressure 0.1–10 Torr (controlled)
Power Supply 24 V DC
Communication RS-485 (Modbus RTU)
Materials 316L SS body, Hastelloy C-276 internal

Material Composition:

  • Body: 316L Stainless Steel
  • Internal Wetted Parts: Hastelloy C-276 (corrosion-resistant)
  • Sensor Element: Platinum RTD (Resistance Temperature Detector)
  • Seals: Viton® / Kalrez® (gas-dependent)
  • Valve: Stainless steel needle valve with PEEK seat

Structure Features:

  • Inline design with VCR inlet/outlet
  • Digital display (optional) or remote control only
  • RS-485 communication port
  • Metal-to-metal seal (no O-ring on gas path)

Working Principle:
Gas flows through a heated capillary tube. A platinum RTD upstream measures gas temperature. A second RTD downstream measures the temperature drop caused by gas flow. The difference is proportional to mass flow rate (King’s Law thermal dispersion principle). A control valve adjusts to maintain the setpoint.

Advantages & Highlights:

  • ±1.0% accuracy — industry-leading for process control
  • < 100 ms response — suitable for fast recipe transitions
  • Hastelloy C-276 internal — compatible with all etch gases
  • RS-485 communication — integrates with AMAT Recipe Execution

Applicable Industries:

  • Semiconductor Etch & Deposition
  • Thin Film Coating
  • Solar Cell Manufacturing

Installation Requirements:

  • Install upright with flow direction arrow pointing toward chamber
  • Use VCR fittings, torque to 25 in-lbs
  • Provide 24 V DC power and RS-485 connection
  • Purge gas line with N₂ before first use

Usage Precautions:

  • Do not exceed rated flow — risk of sensor damage
  • Do not use with gases not rated for internal materials (e.g., SiH₄ requires special MFC)
  • Calibrate every 6 months or per fab SOP
  • Do not apply back-pressure > 10 Torr at inlet
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