AMAT 0010-23716

Product Introduction:
The AMAT 0010-23716 is a precision gas flow control component used in Applied Materials semiconductor wafer processing equipment. It is part of the gas delivery system that supplies process gases (such as NF₃, SiH₄, WF₆, NH₃, O₂, N₂, Ar) to the process chamber at precisely controlled flow rates. This part is typically a Mass Flow Controller (MFC) or a sub-assembly within a gas panel used in PVD (Physical Vapor Deposition), CVD (Chemical Vapor Deposition), or Etch systems.

Category: Others

Description

Technical Specifications:

Parameter	Value
Part Number	0010-23716
Function	Gas Flow Control / Gas Panel Assembly
Gas Type	Process gases (NF₃, SiH₄, WF₆, NH₃, O₂, N₂, Ar, etc.)
Flow Range	0–10 SLM (Standard Liters per Minute) — typical
Control Accuracy	±1.0% of Full Scale (FS)
Repeatability	±0.2% of Full Scale
Response Time (10–90%)	< 100 ms
Operating Pressure	1–10 Torr inlet (typical)
Output Pressure	0.1–5 Torr (chamber-side)
Operating Temperature	-10°C to +50°C
Electrical Interface	Analog 0–5 VDC / 4–20 mA + RS-485 (Modbus)
Power Supply	24 VDC, 5 W max
Wetted Materials	316L Stainless Steel, Hastelloy C-276, PEEK seals
Connection	VCR metal-seal fittings (1/4″ or 1/2″)
Compliance	SEMI S2, SEMI S8

Functional Features:

Closed-loop mass flow control using thermal sensing element
Digital setpoint via RS-485 (Modbus RTU) for recipe-based flow control
Analog output for flow rate monitoring
Built-in pressure and temperature compensation
Self-diagnostic with fault codes via communication
Direct mount to gas panel manifold

Performance Parameters:

Full Scale Flow: 10 SLM (typ.)
Turndown Ratio: 100:1
Zero Drift: < 0.5% FS per year
Span Drift: < 1.0% FS per year
Leak Rate: < 1 × 10⁻⁹ atm·cc/sec (He)

Material Composition:

Body: 316L Stainless Steel, electropolished
Orifice/Sensor Tube: Hastelloy C-276
Seals: PEEK (polyether ether ketone), Kalrez FFKM (for corrosive gases)
Electronics Housing: Aluminum, anodized
Connectors: D-Sub 15-pin (RS-485 + analog)
Heater Element: Platinum RTD

Structural Features:

Inline cylindrical body with VCR fittings on both ends
Electronics module mounted on top with D-Sub connector
LED status indicator (green = OK, red = fault)
DIN rail or panel mount bracket

Working Principle:
Gas enters the MFC through the inlet VCR fitting. A portion of the gas passes through a laminar flow element (LFE) where a thermal mass flow sensor measures the mass flow rate by detecting the temperature difference between two RTDs (one heated, one reference). The control valve (piezo or solenoid-actuated) adjusts the flow to match the setpoint. The electronics module receives the setpoint via RS-485 and outputs the actual flow rate as an analog signal.

Advantages & Highlights:

±1.0% FS accuracy — meets SEMI standards for advanced process nodes
Fast response time < 100 ms — supports rapid gas switching in ALD/CVD
Corrosion-resistant wetted materials — compatible with all standard process gases
Digital + analog interface — flexible integration with AMAT and third-party ECS

Applicable Industries:

Semiconductor manufacturing (front-end wafer fab)
Thin film deposition (PVD, CVD, ALD)
Plasma etching
Cleaning processes
MEMS fabrication

Installation Requirements:

Mount in upright position (vertical flow direction)
Install upstream filter (0.2 µm) for particle protection
Purge with N₂ for 10 min before introducing process gas
Torque VCR fittings to 40 in-lbs
Ground the electronics module to equipment chassis

Usage Precautions:

Do not exceed maximum inlet pressure (10 Torr)
Do not use with gases not listed in the compatibility chart (e.g., F₂ requires special MFC)
Replace PEEK seals every 6 months in corrosive gas service
Calibrate annually per SEMI S2 standard
Do not disassemble the sensor tube — return to AMAT for service

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