TEL 381‑642664‑1

Technical Specifications

• Input Signal Types: 0‑10 V, 4‑20 mA, RTD, thermocouple
• Signal Isolation: galvanic isolation per channel
• Conversion Mode: high‑speed ADC sampling
• Operating Temperature: 5 °C ~ 55 °C (semiconductor equipment internal environment)
• Communication: internal proprietary equipment bus interface Functional Features
• Multi‑channel analog signal acquisition for temperature, pressure, flow physical quantities
• Galvanic channel‑to‑channel isolation suppressing ground‑loop noise
• High‑precision analog‑to‑digital conversion for semiconductor‑grade measurement accuracy
• Fault diagnosis for open‑circuit sensor wiring
• Real‑time data delivery to host equipment controller Application Scenarios
• TEL lithography pre‑post processing systems
• CVD / PVD thin‑film deposition chambers
• Plasma etch semiconductor processing tools
• Wafer handling subsystem parameter monitoring Performance Parameters
• High measurement repeatability for precision semiconductor process
• Noise rejection optimized for high‑EMI factory tool environment Material Composition
• Base substrate: high‑reliability FR‑4 PCB
• Signal‑isolation components: optocoupler isolation devices
• Passive components: high‑stability precision resistors and capacitors
• Edge connector: gold‑plated industrial‑grade connector Structural Characteristics
• Card‑style plug‑in module for TEL equipment backplane slot
• Edge‑connector interface for backplane bus connection
• On‑board terminal block for field sensor wiring
• Shielded mechanical housing for electromagnetic interference suppression Working Principle: Field analog sensor signals enter module terminals, pass through filter and isolation circuits, then feed to high‑precision ADC chips. Analog physical quantities are converted into digital values. On‑board logic transmits digital data over proprietary backplane bus to main equipment controller. Installation Requirements
• Insert into designated slot of original TEL equipment backplane
• Observe ESD protection procedures for semiconductor‑grade electronic assemblies
• Route sensor shield cables with single‑point grounding as per equipment manual Usage Notes
• Designed exclusively for TEL original equipment integration; not for general‑purpose third‑party PLC systems
• Prevent exposure to process chemical vapors, particle contamination and condensation
• Calibration must follow original equipment maintenance procedure
• Replace module only with matching TEL part‑number specification