TEL 1R81‑602755‑13

Technical Specifications:

• Part Number: 1R81‑602755‑13
• Operating Temperature: ‑20 °C ~ +80 °C
• Operating Pressure Range: Vacuum to positive pressure 0.6 MPa
• Tolerance Grade: Precision mechanical tolerance ±0.02 mm
• Surface Roughness: Ra 0.8 μm
• Weight: 145 g
• Dimension: Custom precision dimension matching TEL equipment chamber interface

Functional Features:

• High‑precision dimensional consistency to guarantee vacuum‑sealing performance inside process chamber
• Anti‑corrosion surface treatment to resist erosion from process specialty gases
• Strictly controlled out‑gassing property to avoid contaminating silicon wafer
• Modular plug‑in structure for rapid on‑site replacement
• Strict dimensional traceability for semiconductor‑grade cleanliness requirements

Application Scenarios:

• TEL etcher, deposition tool wafer process chamber internal assembly
• 8‑inch and 12‑inch semiconductor wafer fabrication production lines
• Semiconductor foundry equipment routine maintenance and spare‑part replacement

Performance Parameters:

• Vacuum leak rate: ≤1×10‑9 Pa·m³/s
• Cycle service life: ≥25 000 equipment operation cycles
• Clean‑room compatibility: ISO Class 1 clean‑room assembly requirement

Material Composition:

• Base substrate: Aerospace‑grade aluminum alloy
• Surface treatment: Anodized hard‑coat anti‑corrosion film
• Sealing auxiliary material: High‑purity fluoropolymer

Structural Characteristics:

• Integrated one‑piece precision‑machined structure
• Multi‑position locating pin structure for accurate positioning during installation
• Reserved flow channel or wiring channel matching original equipment mechanical interface

Working Principle: Realizes mechanical positioning, gas conduction or electrical signal transmission inside the semiconductor process chamber. Cooperates with other chamber components to maintain high‑purity vacuum environment required for wafer etching and thin‑film deposition.

Installation Requirements:

• Installation must be completed inside ISO Class 1‑10 clean‑room environment
• Use special‑tool torque control for fastening, torque value strictly follows equipment service manual
• Check sealing surface for scratch and particle pollution before assembly
• Must complete vacuum leak‑detection test after installation