TDK FAW05‑5R0

Technical Specifications: Inductance value 5.0 μH; rated DC current 5 A; saturation current 7.2 A; DCR direct current resistance 18 mΩ; self‑resonant frequency 2.4 MHz; operating temperature range ‑55 °C ~ +155 °C; dimension 5.0 mm × 5.0 mm × 2.5 mm; SMD surface‑mount package; comply with AEC‑Q200 automotive component standard.

Functional Features: Low DC resistance, high‑current resistance; compact SMD small‑size structure; low magnetic leakage flux; excellent high‑temperature stability; anti‑vibration surface‑mount structure; good frequency characteristics; high‑reliability magnetic core material; compatible with standard SMT reflow soldering process.

Application Scenarios: Automotive electronic control unit power circuit, industrial automation DC‑DC converter output filter, portable industrial equipment power module, server power supply circuit, communication equipment power‑filter circuit.

Performance Parameters: Q value 120 at test frequency 1 MHz; inductance tolerance ±20%; saturation current at 30% inductance drop 7.2 A; reflow soldering peak temperature 260 °C maximum.

Material Composition: Ferrite magnetic core; copper alloy winding coil; nickel‑tin plated terminal electrodes; high‑temperature resistant epoxy resin encapsulation material.

Structural Characteristics: Shielded magnetic‑shield structure; rectangular flat SMD surface‑mount outline; two end surface electrodes for PCB soldering; internal winding fully encapsulated by epoxy resin, preventing coil displacement under vibration.

Working Principle: Based on electromagnetic induction principle; store energy in magnetic core during current rising phase; release stored energy during current falling phase; filter high‑frequency ripple component in power‑supply circuit, stabilize output current waveform.

Installation Requirements: Standard SMT surface‑mount soldering on printed circuit board; pad layout matches component outline; avoid placing near high‑heat power components; soldering temperature must follow reflow profile specification; ensure sufficient copper foil area for heat dissipation.

Usage Notes: Do not apply mechanical impact to magnetic core; soldering temperature cannot exceed rated peak temperature; avoid operating beyond saturation current, otherwise inductance value will drop sharply; pay attention to magnetic‑flux interference with surrounding sensitive signal circuits; storage environment requires low‑humidity condition.