SEW 8222215

Technical Specifications

• Power Supply: 24 VDC auxiliary‑logic‑power supplied by host‑drive‑unit
• Supported‑Encoder‑Types: Two‑channel differential incremental‑TTL/RS‑422‑encoder‑input; supports index‑Z‑pulse‑signal
• Maximum‑Encoder‑Input‑Frequency: 1 MHz pulse‑rate
• Physical‑Dimensions: 180 mm × 140 mm × 40 mm overall assembly dimension
• Assembly‑Weight: 0.50 kg total weight
• Operating‑Ambient‑Temperature: ‑10 °C … +55 °C
• Storage‑Temperature‑Range: ‑25 °C … +70 °C
• Mechanical‑Interface: Euro‑card plug‑in‑edge‑connector for MOVIDRIVE‑drive‑internal‑option‑slot

Functional Features

• Dual‑encoder‑channel hardware‑input permitting simultaneous‑connection of two‑incremental‑position‑feedback‑devices
• Hardware‑pulse‑counting‑logic for high‑resolution‑rotary‑position‑tracking
• On‑board‑signal‑filtering‑circuitry suppressing industrial‑EMI‑noise‑interference on encoder‑wiring
• Index‑Z‑pulse‑processing‑function for mechanical‑axis‑homing‑and‑reference‑position‑establishment
• Internal‑parallel‑bus‑communication‑interface transferring‑position‑and‑speed‑actual‑values to drive‑main‑CPU
• Hardware‑fault‑detection for encoder‑wire‑breakage, short‑circuit‑and‑signal‑amplitude‑failure‑conditions

Application Scenarios

• High‑precision‑positioning‑axes using SEW‑MOVIDRIVE‑servo‑drives
• Packaging‑machinery, printing‑equipment, material‑handling‑sorting‑systems, robotic‑auxiliary‑axes
• Drive‑system‑upgrade from open‑loop‑V/F‑control to high‑performance‑closed‑loop‑vector‑or‑servo‑control
• Original‑equipment‑manufacturer‑machine‑spare‑part‑replacement

Performance Parameters

• Position‑count‑resolution determined by external‑encoder‑resolution; hardware‑counter‑circuit supports high‑pulse‑rate‑input‑without‑count‑loss
• Common‑mode‑noise‑immunity meets IEC 61000‑6‑2 industrial‑EMC‑standard
• Fault‑detection‑latency for encoder‑wiring‑fault below 1 ms

Material Composition

• Circuit‑board‑substrate: FR‑4‑multilayer‑printed‑circuit‑board
• Interface‑components: Differential‑line‑receiver‑ICs, high‑speed‑logic‑integrated‑circuits
• Connector‑hardware: Gold‑plated‑edge‑connector‑contacts, D‑sub‑9‑connector‑ports for encoder‑cable‑connection
• Passive‑components: Surge‑suppression‑diodes, filter‑resistors‑and‑capacitors for signal‑conditioning

Structural Characteristics

• Plug‑in‑Euro‑card‑assembly with black‑metal‑front‑bezel‑plate
• Two D‑Sub‑9 female‑connectors mounted onto front‑bezel‑plate for encoder‑cable‑plugs
• Screw‑terminal‑blocks for additional‑signal‑wiring‑access
• Edge‑connector‑located‑at‑rear‑of‑board‑assembly‑for‑mating‑with‑drive‑internal‑back‑plane‑bus‑slot
• Mechanical‑latch‑feature secures‑card‑assembly‑against‑cabinet‑vibration‑movement

Working Principle Two‑incremental‑encoder‑differential‑A‑B‑Z‑signals enter‑through‑D‑Sub‑connectors; line‑receiver‑circuits‑convert‑differential‑analogue‑signals‑to‑digital‑logic‑levels; hardware‑counter‑modules‑accumulate‑pulse‑count‑representing‑shaft‑angular‑position; computed‑actual‑speed‑and‑position‑data‑transmitted‑via‑internal‑parallel‑bus‑towards‑drive‑main‑processor‑to‑execute‑closed‑loop‑position‑and‑speed‑control‑algorithms; hardware‑circuit‑continuously‑monitor‑signal‑integrity‑and‑trigger‑drive‑fault‑status‑upon‑encoder‑system‑failure‑event.

Installation Requirements

• Perform‑card‑insertion‑and‑removal‑operations‑only‑when‑host‑drive‑unit‑is‑completely‑de‑energized
• Insert‑card‑fully‑into‑designated‑MOVIDRIVE‑option‑slot‑until‑mechanical‑latch‑audibly‑engages
• Use‑shielded‑twisted‑pair‑encoder‑cables; connect‑cable‑shield‑to‑D‑Sub‑connector‑shield‑shell‑following‑SEW‑EMC‑installation‑guidance
• Keep‑drive‑cabinet‑ambient‑temperature‑within‑‑10 °C … +55 °C‑operating‑window