SCHNEIDER 140XBP01600

Technical Specifications

• Total Slot Quantity: 16 physical slots
• Slot Assignment: 2 dedicated power‑supply‑slots, 1 CPU‑slot, remaining slots for I/O / communication‑modules
• Supported Power‑Supply Redundancy: Dual‑redundant power‑supply‑module installation
• Operating‑Temperature Range: 0 °C ~ +60 °C
• Storage‑Temperature: ‑40 °C ~ +85 °C
• Mounting Method: DIN‑rail mounting or direct‑panel‑screw‑mounting
• Net Weight: 1.6 kg
• Certifications: CE, UL listed for industrial‑automation‑application
• Function Features
• Provides parallel high‑speed internal back‑plane data‑bus communication among all inserted‑modules
• Supports hot‑swap replacement of I/O and communication‑modules without complete‑system‑shutdown
• Dual‑power‑supply‑slot design enables redundant‑power‑configuration for high‑availability‑automation‑systems
• Rigid mechanical‑structure provides stable module‑insertion‑interface under industrial‑vibration‑conditions
• Standard‑mechanical‑form‑factor compatible with complete‑Modicon‑Quantum‑module‑product‑range Application Scenarios: Large‑scale factory‑process‑automation; power‑plant control‑systems; water‑and‑waste‑water‑treatment‑plants; petrochemical‑process‑control‑systems; heavy‑industry continuous‑production‑line PLC‑control‑platforms.
• Performance Parameters: Back‑plane‑bus high‑speed parallel‑data‑transfer; supports full‑Quantum‑CPU‑performance‑specifications; maximum total‑back‑plane‑current defined by installed‑power‑supply‑module rating.
• Material Composition: Aluminium‑alloy main‑support‑frame; flame‑retardant glass‑filled‑polyamide back‑plane‑substrate assembly; gold‑plated multi‑pin module‑edge‑connectors; steel mounting‑hardware.
• Structural Characteristics: Long linear rack‑assembly; sequential module‑slot positions; rear‑mount‑flange‑holes for panel‑mounting; DIN‑rail‑clip‑mechanism; internal parallel‑bus‑circuit traces integrated on back‑plane‑substrate.
• Working Principle: Mechanically retains all PLC‑system‑modules; internal parallel‑back‑plane‑bus provides power‑distribution and high‑speed‑digital‑data‑communication path between CPU‑unit, power‑supply‑modules, I/O‑and‑communication‑modules; enables CPU to access I/O‑module‑register‑space and exchange process‑data across the rack.
• Installation Requirements: Mount on rigid flat‑panel or standard‑DIN‑rail; maintain minimum side‑clearance for natural‑convection‑cooling; ensure rack‑remains within specified operating‑ambient‑temperature‑range; securely lock each inserted‑module with module‑retention‑clips.