ics Triplex

Technical Specifications Mechanical Specifications Form Factor: Trusted chassis‑mounted module (fits standard Trusted controller/expander chassis slots) Dimensions (H×W×D): 241 mm × 51 mm × 181 mm (9.5 in × 2.0 in × 7.1 in) Weight: 1.2 kg (2.65 lb) Front Panel: 3 speed channel LEDs (green = active), 4 relay output LEDs (red = de‑energized/tripped), power LED (green), fault LED (red), hot swap release lever Mounting: Tool‑less insertion into Trusted chassis Material: Industrial‑grade PCB with conformal coating + CCoat corrosion‑resistant finish; metal shielded enclosure for EMC compliance Connectors: 96‑way C‑type backplane connector; dual redundant 24 VDC power inputs (diode‑ORed) Coating: CCoat corrosion protection (ASTM B117 salt spray compliant) Electrical Specifications Input Type: Magnetic pickup (10–10,000 Hz), proximity sensor (PNP/NPN), optical encoder (TTL/HTL) Input Range: 0.1–100,000 RPM; 0.01–100 g acceleration Input Impedance: 1 kΩ (magnetic pickup); 10 kΩ (proximity/optical) Power Supply: 20–32 VDC redundant backplane supply (24 VDC nominal) Power Consumption: < 8 W maximum Outputs: 4 quad‑redundant DTT relays per machine group (250 VAC/30 VDC, 5 A resistive load) Update Rate: 10 ms (speed measurement); 1 ms (SOE event capture) Isolation: 2500 VDC galvanic between channels, backplane, and field circuits Overvoltage Protection: ±15 VDC (sensor inputs); ±40 VDC (power inputs) Diagnostics: Sensor open/short detection; relay contact monitoring; TMR voting discrepancy alerts; power fault detection

Technical Specifications

1. Mechanical Specifications
   • Form Factor: Trusted chassis‑mounted module (fits T8100 controller/T8300 expander chassis slots)
   • Dimensions (H×W×D): 241 mm × 51 mm × 181 mm (9.5 in × 2.0 in × 7.1 in)
   • Weight: 1.2 kg (2.65 lb)
   • Front Panel: 40 channel status LEDs (green = active), power LED (green), fault LED (red), hot swap release lever
   • Mounting: Tool‑less insertion into Trusted chassis
   • Material: Industrial‑grade PCB with conformal coating; metal shielded enclosure for EMC compliance
   • Connectors: 96‑way C‑type backplane connector; dual redundant 24 VDC power inputs (diode‑ORed)
2. Electrical Specifications
   • Channel Type: 40 independent 24 VDC sinking/sourcing channels (configurable per channel)
   • Input/Output Voltage: 24 VDC (18–30 VDC operating range)
   • Input Current: 10 mA per channel (max)
   • Power Supply: 20–32 VDC redundant backplane supply (24 VDC nominal)
   • Power Consumption: < 9 W maximum
   • Isolation: 2500 VDC galvanic between channels, backplane, and field circuits
   • Update Rate: 5 ms per channel
   • Overcurrent Protection: 20 mA per channel (self‑resetting)
   • Overvoltage Protection: ±36 VDC (no damage to channels)
   • Diagnostics: On‑board open/short circuit detection; TMR voting discrepancy alerts; power fault monitoring

Technical Specifications

• Output Channels: 40 digital output channels for controlling external devices like valves, motors, and relays.
• Voltage Range:
  • System power supply: 20–32 V DC
  • Working output/field voltage: 18–60 V DC
• Isolation: 2500 V pulse-tolerant optical isolation barrier to prevent electrical interference.
• Protection: Automatic overcurrent protection per channel (no external fuses required).
• Response Time: Sub-millisecond switching for real-time control.
• Event Reporting: Sequence of Events (SOE) logging with 1 ms resolution for troubleshooting.
• Power Groups: 8 independent power groups (5 outputs per group) for flexible device power management.
• Environmental Rating: IP20 enclosure (dust-protected, non-immersion-resistant).
• Operating Temperature: -40°C to +70°C, suitable for extreme industrial conditions.
• Communication Protocols: Supports Modbus, Profibus, and Foundation Fieldbus for seamless integration.

Technical Specifications

• Output Channels: 40 digital output channels for controlling external devices like valves, motors, and relays.
• Voltage Range:
  • System power supply: 20–32 V DC
  • Working output/field voltage: 18–60 V DC
• Output Current: 0.75 A per channel
• Response Time: Less than 1 millisecond for rapid switching.
• Isolation: 2500 V pulse-tolerant optical isolation barrier to prevent electrical interference.
• Protection: Automatic overcurrent protection per channel (no external fuses required).
• Power Groups: 8 independent power groups (5 outputs per group) for flexible device power management.

Technical Specifications

1. Mechanical Specifications
   • Form Factor: Trusted chassis‑mounted module (fits T8100 controller/T8300 expander chassis slots)
   • Dimensions (H×W×D): 241 mm × 51 mm × 181 mm (9.5 in × 2.0 in × 7.1 in)
   • Weight: 1.28 kg (2.82 lb)
   • Front Panel: 40 channel status LEDs (green = active), 5 group power LEDs, power LED (green), fault LED (red), hot swap release lever
   • Mounting: Tool‑less insertion into Trusted chassis
   • Material: Industrial‑grade PCB; metal shielded enclosure for EMC compliance
   • Connectors: 96‑way C‑type backplane connector; dual redundant 24 VDC power inputs (diode‑ORed)
   • Hot Swap: SmartSlot technology (Companion Slot or shared spare compatible)

Technical Specifications

• Number of Channels: 40
• Output Range: 4 - 20 mA
• Accuracy: ±0.1% of full scale
• Linearity: ±0.2% of full scale
• Noise: <0.1% of full scale
• Response Time: <250 ms
• Operating Temperature Range: - 40°C to 85°C
• Power Supply Voltage: 24 VDC
• Power Consumption: <10 W
• Dimensions: 2.2 x 12.4 x 12.6 cm
• Weight: 0.1 kg