LAM 810-002895-002

Product Category: Semiconductor Wafer Processing Consumable — Focus Ring

Product Introduction:
The 810-002895-002 is a silicon-coated focus ring used in LAM etch reactors. It sits around the wafer periphery and controls the plasma density profile at the wafer edge, improving etch uniformity and reducing edge non-uniformity.

Category:
Description

Technical Specifications:

Parameter Value
Part Number 810-002895-002
Coating Material Yttria-Stabilized Zirconia (YSZ) or Silicon (Si)
Base Material Silicon or 6061-T6 Aluminum
Diameter 200mm or 300mm (wafer-matched)
Operating Temperature Up to 400°C
Compatible Reactors LAM 2300 Flex, SPE, Kiyo
Ring Width 15–25 mm (typical)

Functional Features:

  • Controls plasma sheath at wafer edge
  • Reduces edge etch rate variation from ±15% to ±3%
  • YSZ/Si coating prevents erosion and particle generation

Performance Parameters:

  • Edge Uniformity Improvement: ±3% vs. ±15% uncoated
  • Service Life: 150–300 wafers (depending on recipe)
  • Particle Performance: < 10 particles/cm²

Material Composition:

Component Material
Body Silicon or 6061-T6 Aluminum
Coating YSZ or Silicon

Working Principle:
The focus ring modifies the electric field distribution at the wafer edge, confining the plasma sheath and preventing the “edge effect” where etch rate spikes at the wafer periphery. The coating protects the ring from plasma erosion.

Key Advantages:

  • Critical for advanced node etch uniformity (< 2% across wafer)
  • Replaceable — low cost relative to chamber hardware

Applicable Industries:

  • Semiconductor Front-End Fab

Installation Requirements:

  • Place on ESC or wafer support pins
  • Verify concentricity with wafer
  • Clean with IPA before installation

Usage Precautions:

  • Inspect for cracks before each use
  • Replace when edge uniformity degrades beyond spec
  • Do not mix coated and uncoated rings in same chamber
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