AMAT 0100-09123

Manufacturer: Applied Materials, Inc.

Product Overview:
High-precision electrostatic chuck used in AMAT etching and deposition chambers. This ESC holds 200 mm or 300 mm wafers via Coulombic electrostatic force, enabling uniform heat transfer and wafer clamping without mechanical stress.

Category: Others

Description

Material Composition:

Electrode Layer: Molybdenum (Mo) — 10 µm thick, plasma-sprayed
Ceramic Insulator: Al₂O₃ (Aluminum Oxide) — 99.6% purity, 3 mm thick
Cooling Channels: Copper (Cu) — Brazed into ceramic body
Top Surface: Anodized Al₂O₃ — 50 µm, Ra ≤ 0.5 µm
Base Plate: 6061-T6 Aluminum — CNC-machined

Technical Specifications:

Parameter	Value
Wafer Size	200 mm / 300 mm (configurable)
Clamping Force	15 – 30 N/cm² (adjustable via DC bias)
DC Bias Voltage	0 – 2,000 V
Cooling Fluid	Deionized water / Helium (He backside)
Cooling Capacity	500 W (He), 200 W (DI water)
Temperature Uniformity	±1°C across wafer surface
Surface Flatness	≤ 5 µm TIR
Chuck Life	> 1,000,000 cycles
Particle Generation	< 0.1 µm — Class 1 per ISO 14644-1

Working Principle:
DC voltage applied between the Mo electrode and the wafer creates an electrostatic Coulombic force that clamps the wafer to the chuck surface. Heat is transferred through the ceramic insulator via conduction to internal Cu cooling channels.

Key Advantages:

Zero mechanical stress on wafer — eliminates breakage and slip marks
Sub-degree temperature uniformity critical for advanced etch processes
Fast de-chuck — voltage removal in < 100 ms releases wafer

Applicable Industries:
Semiconductor manufacturing — Etch (DRIE, RIE), CVD, PVD, CMP

Installation Requirements:

Connect high-voltage DC supply via SHV connector — 2,000 V max
Verify cooling flow rate ≥ 2 L/min before wafer processing
Perform de-ionized water resistivity check > 18 MΩ·cm

Reviews (0)

Reviews

There are no reviews yet.

Be the first to review “AMAT 0100-09123”

Shipping and Delivery

MAECENAS IACULIS

Vestibulum curae torquent diam diam commodo parturient penatibus nunc dui adipiscing convallis bulum parturient suspendisse parturient a.Parturient in parturient scelerisque nibh lectus quam a natoque adipiscing a vestibulum hendrerit et pharetra fames nunc natoque dui.

ADIPISCING CONVALLIS BULUM

Vestibulum penatibus nunc dui adipiscing convallis bulum parturient suspendisse.
Abitur parturient praesent lectus quam a natoque adipiscing a vestibulum hendre.
Diam parturient dictumst parturient scelerisque nibh lectus.

Scelerisque adipiscing bibendum sem vestibulum et in a a a purus lectus faucibus lobortis tincidunt purus lectus nisl class eros.Condimentum a et ullamcorper dictumst mus et tristique elementum nam inceptos hac parturient scelerisque vestibulum amet elit ut volutpat.