CS Triplex T8310C Trusted CCoat TMR Expander Processor Module

Technical Specifications

  1. Mechanical Specifications
    • Form Factor: Plug‑in module for T8300 expander chassis (occupies two leftmost processor slots)
    • Dimensions (H×W×D): 160 mm × 320 mm × 120 mm (6.3 in × 12.6 in × 4.7 in)
    • Weight: 1.33 kg (2.9 lb)
    • Front Panel: Three status LEDs (health: green = OK, active/standby: amber = active, Tx/Rx: flashing green = data transfer); TC‑301 hot link port for T8312 adapter connection
    • Mounting: Tool‑less insertion into T8300 expander chassis backplane
    • Material: Industrial‑grade printed circuit board (PCB) with conformal coating; metal housing with corrosion‑resistant finish
    • Interface: TC‑301 hot link port (for T8312 adapter connection)
  2. Electrical Specifications
    • Power Supply: 20–32 VDC dual redundant backplane power (supplied by T8300 chassis)
    • Power Consumption: 45 W maximum
    • Heat Dissipation: 45 W
    • Architecture: HIFT Triple Modular Redundancy (TMR) with majority voting
    • Clock Speed: 50 MHz module clock
    • Communication Data Rate: 250 Mbps (via TC‑301 hot link cable)
    • Isolation: 1500 VDC channel‑to‑channel and channel‑to‑chassis; 50 V basic insulation module‑to‑backplane
    • Redundancy: Hot standby and module sparing configurations supported

CS Triplex T8432 Trusted 1oo2D 60‑Channel Dual Analog Input Module

Technical Specifications

  1. Mechanical Specifications
    • Form Factor: Trusted chassis‑mounted module (fits standard Trusted controller/expander chassis slots)
    • Dimensions (H×W×D): 241 mm × 51 mm × 181 mm (9.5 in × 2.0 in × 7.1 in)
    • Weight: 0.95 kg (2.09 lb)
    • Front Panel: 60 channel status LEDs (green = active), power LED (green), fault LED (red), hot swap release lever
    • Mounting: Tool‑less insertion into Trusted chassis (compatible with T8300 expander chassis)
    • Material: Industrial‑grade PCB with conformal coating; metal shielded enclosure for EMC compliance
    • Connectors: 96‑way C‑type backplane connector; dual redundant 24 VDC power inputs (diode‑ORed)
  2. Electrical Specifications
    • Input Signal: Configurable per channel—0–10 VDC, ±10 VDC, 0–5 VDC (voltage mode only)
    • Input Impedance: 1 MΩ (compatible with 2‑wire/3‑wire voltage transmitters)
    • Power Supply: 20–32 VDC redundant backplane supply (24 VDC nominal)
    • Power Consumption: < 7 W maximum
    • Resolution: 16‑bit (152.6 μV LSB for 0–10 VDC; 305.2 μV LSB for ±10 VDC; 76.3 μV LSB for 0–5 VDC)
    • Accuracy: 0.05% of full scale (calibrated)
    • Update Rate: 100 ms per channel (configurable via Trusted software)
    • Isolation: 2500 VDC galvanic isolation between channels and backplane
    • Overrange Protection: ±15 VDC (no damage); reverse polarity protection (-32 VDC to +40 VDC)
    • Diagnostics: On‑board open/short circuit detection; 1oo2D voting discrepancy alerts; 1 ms SOE reporting

CS Triplex T8800 Trusted 40‑Channel 24 VDC Digital Input Field Termination Assembly

Technical Specifications

  1. Mechanical Specifications
    • Form Factor: Field‑mounted FTA (compatible with Trusted T8400 digital input modules)
    • Enclosure: Cast‑aluminum, IP65‑rated for dust and water ingress protection
    • Dimensions (H×W×D): 254 mm × 203 mm × 152 mm (10.0 in × 8.0 in × 6.0 in)
    • Weight: 3.0 kg (6.61 lb)
    • Front Panel: 40 channel status LEDs (green = active), 5 group power LEDs, power LED (green), fault LED (red), locking field connectors
    • Mounting: Wall/pipe‑mountable (DIN rail adapter optional)
    • Connectors: 2 × 24‑way heavy‑duty field connectors; 96‑way C‑type backplane connector for module interface
    • Fuses: 5 × 8‑channel group fuses (2 A, fast‑acting) for field power protection

ICS TRIPLEX 8431

  • Supply Voltage Range: 20 to 32V DC
  • Number of Inputs: 40 channels
  • Weight: 1.149 kg
  • Resolution: 1 ms
  • Filtering: Configurable 50/60 Hz digital filtering

ICS Triplex T7122 24VDC 512K Triple-Modular Redundant (TMR) Processor Module

Technical Specifications

  1. Electrical Specifications
    • Operating Voltage: 20–30 VDC (rated 24 VDC)
    • Maximum Power Consumption: 100 VA
    • Memory Capacity: 512K Bytes of program and data memory
    • Input Channels: 40 channels per Field Terminal Assembly (FTA)
    • Field Connections: Industry - standard 2 - wire field device connections; fused field power per channel
    • Isolation: Reinforced electrical isolation between field circuits and backplane to prevent cross - interference
  2. Mechanical Specifications
    • Chassis Compatibility: Specifically designed for T7102 controller chassis (Part No.: 700216, Rev: C)
    • Dimensions: Standard ICS Triplex module form factor, compatible with standard rack - mount installation
    • Weight: Approximately 3.19 kg (varies slightly by revision)
    • Mounting: Supports standard DIN - rail and rack - mount installation via chassis; hot - swappable via push - button "education" function
    • Indicators: On - board LEDs for power status, module health, fault alerts, and field power integrity

ICS Triplex T8100 Trusted TMR Controller Chassis

Technical Specifications

  1. Electrical Specifications
    • Operating Voltage: 20–32 VDC (rated 24 VDC)
    • External Fusing: 20 A external fuse for power input protection
    • Backplane Power: Redundant power distribution to all module slots; 80 W maximum total power dissipation
    • Backplane Architecture: Triple redundant Inter - Module Bus (IMB) for TMR communication and voting
    • Isolation: Reinforced isolation between field circuits, backplane, and chassis ground
    • SOE (Sequence of Events) Buffer: 1000 local events, with a 4000 - event CI (Communication Interface) buffer for post - incident analysis
  2. Mechanical Specifications
    • Form Factor: 19" standard rack - mount chassis, compatible with EIA - 310 - D rack standards
    • Module Slots: Supports up to 16 T8000 - series I/O, processor, and communication modules
    • Connectors: 10×DIN 41642 male connectors for field and backplane connections
    • Indicators: Front - panel LEDs for global power status, backplane health, and module fault alerts; optional front - door window for LED visibility
    • Protection Rating: IP20 (front panel); protects against dust and finger contact
    • Weight: Approximately 10 kg (varies by configuration)

ICS TRIPLEX T8110B Trusted TMR Processor

Technical Specifications:
  • System Architecture: The T8110B operates on a fault-tolerant architecture designed to maintain system availability and integrity even in the event of hardware failures. It supports triple modular redundancy (TMR) to ensure continuous operation.
  • Processor Capabilities: Equipped with advanced processors capable of executing complex control logic and diagnostics simultaneously across multiple channels, ensuring reliable performance under demanding conditions.
  • Memory: Includes onboard memory for storing critical application programs, historical data, and system parameters, supporting extensive configuration and logging capabilities necessary for safety systems.
  • Communication Interfaces: Supports various communication protocols including Modbus, Ethernet, and proprietary interfaces, enabling seamless integration with distributed control systems (DCS) and other plant networks.
  • Input/Output Channels: Designed to interface with a wide range of digital and analog input/output modules, allowing connectivity with field devices like sensors and actuators for comprehensive monitoring and control.
  • Power Supply Requirements: Operates on a dedicated power supply unit that provides stable voltage necessary for reliable operation, often includes options for redundant power supplies to enhance system reliability.
  • Environmental Tolerance: Built to withstand harsh industrial environments, featuring resistance to temperature extremes, humidity, vibration, and electromagnetic interference.

ICS Triplex T8110B Trusted Triple Modular Redundant (TMR) Processor Module

Technical Specifications
  • Processor Architecture: Triple-redundant design with three independent processors running in parallel.
  • Voltage Range: 20 V DC to 32 V DC.
  • Power Consumption: 80 W (maximum load).
  • Processor Clock Speed: 100 MHz.
  • I/O Interface: Triple-redundant module-to-module communication bus.
  • SOE Buffer Size: 1000 events (expandable to 4000 events in CI buffer).
  • Operating Temperature: 0 °C to 60 °C (32 °F to 140 °F).
  • Storage Temperature: -25 °C to 70 °C (-13 °F to 158 °F).
  • Dimensions (L × W × H): 30.3 cm × 9.3 cm × 26.6 cm.
  • Weight: 2.94 kg (shipping weight: 4 kg).
  • Communication Protocols: Supports Modbus TCP/IP, Ethernet, and serial interfaces for seamless integration with other systems.

ICS Triplex T8111C Trusted Triple – Modular Redundant (TMR) Processor Module

Technical Specifications

  1. Electrical Specifications
    • Operating Voltage: 20–32 VDC (rated 24 VDC)
    • Power Consumption: 30 VA (max)
    • Memory Capacity: 32 MB RAM, 128 MB flash memory for program and data storage
    • Processor Architecture: Hardware - Implemented Fault - Tolerant (HIFT) with triple redundant processing cores
    • Communication Interfaces: Front - panel RS232 serial port, Ethernet (TCP/IP), Modbus TCP/IP; supports redundant communication links
    • Time Synchronization: IRIG - B002 and B122 time code input for precise event correlation
    • Isolation: Reinforced electrical isolation between field circuits, backplane, and module core
  2. Mechanical Specifications
    • Chassis Compatibility: Exclusively designed for T8100 Trusted TMR controller chassis
    • Form Factor: Standard T8000 - series module size, 19" rack - mount compatible
    • Weight: Approximately 1.9 kg (varies slightly by revision)
    • Mounting: Hot - swappable via push - button "education" function; no system shutdown required for replacement
    • Indicators: Front - panel LEDs for power status, module health, fault alerts, voting status, and communication link integrity

ICS Triplex T8122 Trusted Processor Interface Adapter

Technical Specifications

  1. Electrical Specifications
    • Operating Voltage: 20–32 VDC (rated 24 VDC, derived from T8100 chassis backplane)
    • Communication Ports: 2 configurable RS422/485 (2 - or 4 - wire), 1 fixed RS422/485 (2 - wire)
    • Signal Isolation: Reinforced isolation (1500 VDC) between communication circuits and chassis ground
    • Fault/Fail Signal Inputs: Dedicated terminals for active/standby processor fault and fail signals
    • PSU Monitoring: Inputs for tracking power supply shutdown signals from the T8100 chassis
    • Diagnostic Interface: 1 dedicated port for processor diagnostics and configuration access
  2. Mechanical Specifications
    • Form Factor: Rear - mounted adapter for T8100 chassis, matching T8000 - series module dimensions
    • Mounting: Direct connection to the chassis rear panel; no additional tools required for installation
    • Dimensions: 9.5 cm × 6.3 cm × 2.1 cm
    • Weight: Approximately 0.3 kg
    • Indicators: LED indicators for power status, communication link activity, and fault signal detection
  3. Environmental Specifications
    • Operating Temperature: - 40°C to +70°C
    • Storage Temperature: - 40°C to +85°C
    • Relative Humidity: 5%–95% (non - condensing)
    • Shock Resistance: 30 g, 11 ms duration (per IEC 60068 - 2 - 27)
    • Vibration Resistance: 5 g, 10–150 Hz (per IEC 60068 - 2 - 6)

ICS Triplex T8123 Trusted TMR Processor Interface Adapter

Technical Specifications

  1. Electrical Specifications
    • Operating Voltage: 20–32 VDC (rated 24 VDC, supplied by T8100 chassis backplane)
    • Communication Ports: 2 configurable RS422/485 (2‑wire or 4‑wire), 1 fixed RS422/485 (2‑wire)
    • Time Synchronization: IRIG‑B002/B122 time code input for precise event correlation
    • Signal Isolation: Reinforced 1500 VDC isolation between communication circuits and chassis ground
    • Fault/Fail Terminals: Dedicated inputs for active and standby processor fault/fail signals
    • PSU Monitoring: Inputs to track T8100 chassis power supply shutdown signals
    • Diagnostic Interface: 1 dedicated port for processor configuration and troubleshooting
  2. Mechanical Specifications
    • Form Factor: Rear‑mounted adapter for T8100 chassis, matching T8000‑series module dimensions
    • Mounting: Direct rear‑panel connection; no additional tools required for installation
    • Dimensions: 16 cm × 16 cm × 12 cm (typical)
    • Weight: Approximately 0.8 kg
    • Indicators: Front‑panel LEDs for power status, communication link activity, and fault signal detection
  3. Environmental Specifications
    • Operating Temperature: -40°C to +70°C
    • Storage Temperature: -40°C to +85°C
    • Relative Humidity: 5%–95% (non‑condensing)
    • Shock Resistance: 30 g, 11 ms duration (per IEC 60068‑2‑27)
    • Vibration Resistance: 5 g, 10–150 Hz (per IEC 60068‑2‑6)

ICS Triplex T8151B Trusted Communications Interface Module

Technical Specifications

  1. Electrical Specifications
    • Operating Voltage: 20–32 VDC (rated 24 VDC, supplied by T8100 chassis backplane)
    • Power Consumption: 24 W (excludes T8153 adapter power draw)
    • Communication Interfaces: 2×10/100BaseT Ethernet (copper), 4×RS422/485 (via T8153), 1×RS232 front‑panel diagnostic port
    • Ethernet Data Rate: 10/100 Mbit/s (auto‑sensing)
    • Serial Port Baud Rate: 1.2–115.2 kbps (configurable)
    • Processor: Motorola PowerPC (dedicated communication processor)
    • Memory: Flash memory (firmware), RAM (runtime data), EPROM (bootstrap software)
    • Signal Isolation: Reinforced 1500 VDC isolation between communication circuits and chassis ground
  2. Mechanical Specifications
    • Form Factor: 3U Eurocard single‑width module
    • Mounting: Installs in any single‑width slot of T8100 controller/expander chassis
    • Dimensions (H×W×D): 241 mm × 30 mm × 300 mm (9.5 in × 1.2 in × 11.8 in)
    • Weight: 1.23 kg (2.71 lbs)
    • Indicators: Front‑panel LEDs for power, Ethernet link/activity, serial port activity, module fault, and system status
    • Companion Adapter: T8151B requires T8153 rear‑mounted adapter for external serial/Ethernet connections