Densan DVESH7750

Product Overview
Densan supplies VME and embedded CPU boards for industrial systems, and Densan is listed among solution partners for SH7750 reference and development platforms. The model suffix SH7750 aligns with the Renesas/Hitachi SH-4 SuperH microprocessor family. Where DVESH7750 integrates an SH7750 core, the processor parameters below apply; board-level I/O assignments must be confirmed from the original Densan schematic.
Category:
Description
Technical Specifications
  • CPU core: Renesas SH7750, 32-bit SuperH RISC, SH-4 compatible.
  • Clock options: 128 MHz, 167 MHz, 200 MHz or 240 MHz depending on SH7750/SH7750S/SH7750R variant.
  • Cache: 8 KB instruction and 16 KB data for SH7750/SH7750S; 16 KB instruction and 32 KB data for SH7750R.
  • External data bus: 64-bit external data bus with 26-bit address capability on the SH7750 core.
  • FPU: 32-bit single-precision registers 16 by 32 or 64-bit double-precision registers 8 by 64, plus vector graphics support on selected SH7750 configurations.
  • Memory interface: direct connection to SDRAM, EDO/FAST PAGE DRAM, SRAM, ROM and Flash through the bus state controller.
  • Peripherals: DMAC, TMU timers, RTC, SCIF/SI serial communication, watchdog, MMU and interrupt controller.
  • I/O voltage: 3.3 V I/O; core voltage depends on the specific SH7750 grade, commonly 1.8 V or 1.5 V.
Key Features
  • Superscalar dual-issue RISC execution for real-time embedded control.
  • Integrated FPU and optional vector unit for multimedia or signal-processing loads.
  • MMU support for Windows CE, VxWorks, Linux, QNX, Nucleus and other real-time operating systems.
  • Low-power sleep and standby modes for embedded installations.
Application Scenarios
  • Industrial human-machine interface and graphics terminals.
  • Semiconductor equipment controllers requiring deterministic real-time response.
  • Communication gateways, set-top platforms and embedded computing prototypes.
Performance Parameters
  • Dhrystone performance: approximately 230 MIPS at 128 MHz, 360 MIPS at 200 MHz for standard SH7750 configurations.
  • Typical power: around 900 mW full operation for selected 200 MHz grades; lower values for 128 MHz and sleep modes.
  • Bus width and cache size must be matched to the installed SH7750 silicon revision.
Material Composition
  • Multilayer FR4 PCB with surface-mount SH7750 BGA or QFP package.
  • Tantalum or ceramic decoupling capacitors, SDRAM/SRAM devices, flash memory and passive termination network.
  • Gold or nickel VME edge connectors where the board uses a VME form factor.
Structural Characteristics
  • VME double-height or 6U layout where implemented as a Densan VME SBC.
  • Processor, memory bank, flash bank, serial transceivers and VME interface controller mounted on one rigid card.
  • Debug headers, JTAG or emulator ports according to the original design revision.
Working Principle
The SH7750 core fetches instructions from onboard flash or backplane memory, executes integer, floating-point and vector operations, and transfers data through the bus state controller to SDRAM, VME I/O and serial peripherals. Direct memory access channels move block data without continuous CPU intervention, reducing latency for real-time control.
Installation Requirements
  • Confirm VME slot compatibility, board height and backplane signal assignment before insertion.
  • Supply the specified 3.3 V I/O and core voltage through the VME power pins or auxiliary regulator.
  • Load the approved boot firmware and operating-system image validated for the SH7750 revision.
  • Provide adequate chassis cooling for the selected CPU clock frequency.
Usage Precautions
  • Use ESD grounding before touching the BGA/QFP processor or memory devices.
  • Never install an SH7750 board into a 5 V-only VME backplane without verifying level translation.
  • Match operating-system BSP, boot loader and firmware to the exact SH7750 grade.
  • Avoid prolonged exposure to high humidity, conductive dust and unsuppressed power surges.
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