LAM 853-001983-011

Product Name: 853-001983-011 Dual-Channel Endpoint Detector Assembly

Product Description: Precision optical endpoint detection module designed for semiconductor plasma etching equipment. Serves as a critical process control component for LAM Research etch systems, enabling accurate determination of etch process completion by monitoring optical emission changes from the plasma.

Category:
Description
Technical Specifications:
  • Detection Channels: 2 independent optical channels
  • Detection Principle: Optical emission spectroscopy (OES) endpoint detection
  • Wavelength Range: Configurable bandpass filters for target material emission lines
  • Response Time: Sub-millisecond signal response for real-time process control
  • Operating Temperature Range: 15°C to 30°C (controlled cleanroom environment)
  • Power Supply: 24 VDC
  • Output Interface: Analog and digital process control signals
  • Compatibility: LAM Autoetch 490B and compatible etch platforms

    Functional Features:

  • Dual-channel detection architecture for enhanced reliability and measurement redundancy
  • High-sensitivity optical sensors for detecting faint emission intensity changes
  • Precision bandpass filter selection for target material etch processes
  • Real-time signal processing and endpoint detection algorithms
  • Compact modular design for integration into etch chamber side ports
  • Cleanroom-compatible construction with low particle generation

    Application Scenarios:

  • Semiconductor wafer plasma etching processes
  • Silicon dioxide, metal, and polysilicon etch endpoint detection
  • LAM Research Autoetch series etch systems
  • Semiconductor front-end manufacturing process control
  • Advanced logic and memory device fabrication

    Material Composition:

  • Housing: Anodized aluminum alloy enclosure with chromate conversion coating
  • Optics: Precision glass bandpass filters, collimating lenses, and photodiode sensors
  • Circuitry: Low-noise analog signal conditioning and digital processing PCB
  • Sealing: Viton seals for vacuum compatibility and particle containment
  • Mounting Flange: Stainless steel vacuum flange for chamber integration

    Structural Characteristics:

  • Compact in-line optical design for direct mounting on chamber viewports
  • Dual independent optical paths with separate filter and detector assemblies
  • Vacuum-sealed flange interface for chamber integration
  • Shielded electrical connector for signal and power connection

    Working Principle:

    The detector collects optical emission from the plasma through a chamber viewport. The dual optical channels split the light into separate paths, each passing through a dedicated bandpass filter tuned to a specific emission wavelength of the material being etched. Photodiodes convert the filtered light intensity into electrical signals, which are amplified and processed by the internal circuitry. The module monitors the rate of change in emission intensity, identifying the characteristic endpoint signature when the target material is fully etched, and sends a trigger signal to the etch system controller to stop the process.

    Installation Requirements:

  • Install on designated etch chamber viewport flange with proper vacuum sealing
  • Align optical path with plasma emission source according to LAM alignment procedures
  • Connect vacuum-side and atmosphere-side components per cleanroom assembly protocols
  • Route signal and power cables away from high-EMI chamber components
  • Perform leak check and particle verification after installation in accordance with semiconductor facility standards

    Usage Precautions:

  • Handle optical components only in cleanroom environments using proper ESD and particle control procedures
  • Do not touch optical surfaces with bare hands or expose to contaminants
  • Periodically inspect viewport windows for deposition buildup and clean per maintenance procedures
  • Ensure all electrical connections are properly shielded and grounded to avoid signal noise
  • Only perform service and calibration procedures using LAM-approved tools and protocols
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