HUMO HC‑6002‑2

Technical Specifications

Form‑factor: VME‑bus standard‑card‑size; Dimension: 167 mm × 148 mm × 55 mm; Weight: 0.6 kg; Signal‑input‑range ±10 V; Analog‑to‑digital‑conversion‑resolution 16‑bit; Conversion‑accuracy ±0.1%; Operating‑temperature‑range ‑40 °C ~ +85 °C; Support‑VME‑bus‑high‑speed‑data‑transmission‑rate‑up‑to‑160 MB/s; Dual‑DB9‑serial‑communication‑connectors on‑front‑panel; Gold‑plated VME‑bus‑back‑plane‑connector at‑rear‑edge.

Functional Features

Multi‑channel‑analog‑signal‑acquisition; High‑precision‑A/D‑conversion; VME‑bus‑back‑plane‑data‑interaction; Dual‑channel‑serial‑communication‑interface‑output; High‑noise‑immunity‑circuit‑design‑for‑harsh‑industrial‑environment; Compact‑VME‑card‑structure‑for‑rack‑chassis‑installation; On‑board‑hardware‑signal‑conditioning‑circuit; Support‑legacy‑industrial‑control‑system‑signal‑interface‑conversion work.

Application Scenarios

Legacy‑industrial‑automation‑rack‑control‑systems, process‑control‑equipment, manufacturing‑plant‑signal‑acquisition‑systems, special‑purpose‑industrial‑machinery‑control‑cabinets, retrofitting‑maintenance‑of‑old‑VME‑bus‑based‑automation‑equipment.

Performance Parameters

16‑bit‑high‑resolution‑analog‑signal‑sampling; ±0.1%‑full‑scale‑conversion‑accuracy; Wide‑temperature‑range‑stable‑operation; High‑anti‑interference‑ability‑for‑industrial‑field‑electromagnetic‑noise; Conform‑to‑VME‑bus‑hardware‑electrical‑specification; Stable‑high‑speed‑back‑plane‑data‑transmission‑capability.

Material Composition

Glass‑epoxy‑printed‑circuit‑board‑substrate; Gold‑plated‑VME‑bus‑rear‑connector; Metal‑shell‑DB9‑front‑panel‑serial‑connectors; Industrial‑grade‑integrated‑circuit‑chips; Surface‑mount‑passive‑components; Metal‑card‑front‑panel‑bracket; Conformal‑coating‑on‑circuit‑board‑for‑environmental‑protection.

Structural Characteristics

Standard‑VME‑single‑height‑card‑mechanical‑form‑factor; Metal‑front‑panel‑with‑two‑DB9‑connectors; Rear‑edge‑gold‑plated‑VME‑bus‑back‑plane‑connector; Internal‑multi‑layer‑printed‑circuit‑board‑layout; Card‑edge‑guide‑groove‑structure‑for‑chassis‑slot‑insertion; Screw‑fastening‑holes‑on‑front‑panel‑for‑fixing‑into‑chassis‑slot‑position.

Working Principle

Analog‑field‑signals‑enter‑through‑front‑panel‑connectors, pass‑through‑on‑board‑signal‑conditioning‑circuit‑to‑adjust‑signal‑amplitude‑and‑filter‑interference‑noise. High‑precision‑A/D‑converter‑transforms‑analog‑signal‑into‑digital‑data. Digital‑data‑transmits‑to‑system‑back‑plane‑via‑VME‑bus‑connector; meanwhile module‑receives‑system‑commands‑from‑back‑plane‑and‑output‑signals‑through‑serial‑interface‑channels to‑complete‑signal‑acquisition‑and‑interface‑conversion‑functions.

Installation Requirements

Insert‑card‑into‑standard‑VME‑bus‑chassis‑slot‑along‑slot‑guide‑rail; Ensure‑rear‑VME‑bus‑connector‑fully‑plug‑into‑chassis‑back‑plane‑connector; Fasten‑front‑panel‑mounting‑screws‑to‑chassis‑frame; Chassis‑must‑provide‑specified‑VME‑bus‑power‑supply; Keep‑chassis‑internal‑ventilation‑for‑heat‑dissipation; Avoid‑install‑in‑location‑with‑direct‑vibration‑impact; Route‑field‑signal‑cables‑separate‑from‑high‑power‑cables to‑reduce‑electromagnetic‑interference.

Usage Notes

Only‑operate‑within‑VME‑bus‑chassis‑system‑with‑qualified‑power‑supply; Power‑off‑chassis‑power‑before‑plug‑in‑or‑pull‑out‑module‑card; Prevent‑conductive‑dust‑and‑moisture‑inside‑chassis‑environment; Do‑not‑apply‑input‑signal‑voltage‑exceed‑module‑specified‑±10 V‑range; Check‑front‑panel‑DB9‑connector‑cable‑crimp‑quality‑regularly‑during‑maintenance; Do‑not‑remove‑board‑conformal‑coating‑if‑not‑required‑by‑repair‑work.