LAM 810‑017034‑005

Technical Specifications

• Processor: Motorola 68030
• Bus Interface: VME bus
• Memory: 256 KB RAM
• Serial Interface: RS‑232
• Operating Temperature: ‑40 °C ~ +85 °C Function Features
• Executes real‑time control firmware for semiconductor tool subsystems
• Processes sensor input signals and generates actuator output commands
• Stores process‑recipe parameters and equipment runtime log data
• Realizes high‑speed data exchange over VME backplane with other VME‑form‑factor boards
• Supports local diagnostic self‑test at power‑on sequence Application Scenarios: Lam Research series plasma etch and thin‑film deposition wafer processing tools, equipment subsystem control cabinet, clean‑room semiconductor fabrication environment. Performance Parameters: Multi‑task real‑time processing capability; meets clean‑room industrial electronic reliability requirements; conforms to SEMI equipment specification. Material Composition: Multi‑layer high‑reliability FR‑4 PCB; gold‑plated VME edge connector; industrial‑grade CPU, memory and peripheral chips; aluminum alloy mounting bracket. Structural Characteristics: Standard VME 6U card dimension; metal reinforcing frame for mechanical rigidity; edge‑card VME backplane connection; on‑board status indicator LEDs. Working Principle: Receives high‑level process‑recipe instructions from host system via VME bus; runs embedded firmware to decompose process sequences; reads sensor signal data from associated I/O boards; outputs control commands to drive actuators; uploads operating status and fault information back to main system controller. Installation Requirements: Power‑off chassis before board insertion; insert into designated VME chassis slot; fasten front‑panel mounting screws; guarantee full contact of VME edge‑connector with backplane socket. Usage Notes: Operate inside clean‑room environment; avoid mechanical impact and static‑electric discharge; prevent corrosive gas‑by‑product contamination; perform firmware version matching with equipment host software.