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LAM 810-002895-002
LAM 810-002895-002

LAM 810-001489-016

Product Category: Semiconductor Wafer Processing Consumable — Chamber Liner

Product Introduction:
This is a silicon-coated aluminum chamber liner (shield) used in LAM Research plasma etch reactors. It protects the chamber walls from plasma erosion and provides a controlled surface for process chemistry interaction. The YSZ coating ensures long life and low particle generation.

Category:
Description

Technical Specifications:

Parameter Value
Part Number 810-001489-016
Coating Material Yttria-Stabilized Zirconia (YSZ)
Base Material 6061-T6 Aluminum Alloy
Coating Thickness 200–350 μm
Operating Temperature Up to 350°C
Compatible Reactors LAM SPE, 2300 Flex, Kiyo
Surface Finish Ra ≤ 1.6 μm (coated)

Functional Features:

  • Protects chamber walls from fluorine/chlorine plasma attack
  • YSZ coating is chemically inert to most etch chemistries
  • Replaceable consumable with defined service interval

Performance Parameters:

  • Erosion Rate: < 0.3 μm/hour (YSZ-coated)
  • Particle Generation: < 5 particles/cm² post-coat
  • Service Life: 100–200 process hours

Material Composition:

Component Material
Body 6061-T6 Aluminum
Coating YSZ (8% Y₂O₃-ZrO₂)

Working Principle:
The liner is mounted inside the etch chamber, directly exposed to plasma. The YSZ coating acts as a sacrificial barrier — it erodes far more slowly than bare aluminum, protecting the chamber and preventing metallic contamination of the wafer.

Key Advantages:

  • Extends chamber hardware life by 5–10× vs. uncoated
  • Low particle generation critical for advanced nodes (7nm and below)
  • KLA OEM quality with traceable coating process

Applicable Industries:

  • Semiconductor Front-End Fab

Installation Requirements:

  • Install in ISO Class 5 cleanroom
  • Verify O-ring seating
  • Perform leak check at 10⁻⁶ Torr·L/s

Usage Precautions:

  • Replace after defined service hours — coating degrades invisibly
  • Handle with ESD-safe gloves
  • Do not clean with abrasive materials
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