GE IC698CHS117C

  • Product Introduction: The IC698CHS117C is an 18‑slot wall‑mount I/O chassis for GE PACSystems RX7i PACs, built on a VME64 backplane with 4x standard VME bandwidth for high‑speed I/O throughput. It supports RX7i CPUs, RX7i I/O modules, Series 90‑70 I/O, and standard VME modules, with slot 0 dedicated to power modules, slot 1 for CPU (slot 2 used if dual‑width CPU with embedded Ethernet), and slots 3–18 for I/O. It features slot sensing, software configuration (no DIP switches/jumpers), and works with high‑power RX7i power supplies, delivering reliable, scalable I/O expansion for industrial control systems.
  • Manufacturer: GE Fanuc (General Electric Fanuc Intelligent Platforms, now part of Emerson Automation)
  • Chassis Type: 18‑slot wall‑mount I/O chassis for PACSystems RX7i
Category:
Description
  • Backplane Standard: VME64, 4x standard VME bandwidth for faster I/O data transfer
  • Slot Configuration: Slot 0 (power module, 2.6‑inch width); Slot 1 (CPU, 0.8‑inch width; dual‑width CPU uses slots 1+2); Slots 3–18 (16 I/O slots, 0.8‑inch each)
  • Module Compatibility: RX7i CPUs, RX7i I/O modules, Series 90‑70 I/O modules, standard VME modules
  • Max Module Count: 15 single‑width I/O modules (no dual‑width); 8 dual‑width I/O modules; mix of single/dual‑width modules (up to 18 total slots)
  • Slot Sensing: Automatic module detection via backplane; no DIP switches/jumpers
  • Configuration: Software‑based via PACSystems RX7i programming tools
  • Power Support: 350W high‑power RX7i power supplies; outputs: +5 VDC (60 A), +12 VDC (12 A), -12 VDC (4 A)
  • Physical Dimensions: 483 mm × 368 mm × 178 mm (19.0 in × 14.5 in × 7.0 in)
  • Weight: 7.3 kg (16.1 lbs)
  • Operating Temperature: 0°C to 60°C
  • Storage Temperature: -40°C to 85°C
  • Relative Humidity: 5% to 95% (non‑condensing)
  • Protection: Requires IP54 or higher enclosure for industrial use
  • Certifications: CE, UL 61010‑1, CSA C22.2 No. 61010‑1, EU RoHS compliant
  • High Bandwidth Backplane: VME64 architecture with 4x standard VME throughput enables fast I/O data exchange for time‑critical applications
  • Broad Module Support: Works with RX7i CPUs/I/O, Series 90‑70 I/O, and VME modules for flexible system design
  • Automatic Slot Sensing: Eliminates manual DIP switch/jumper setup; reduces configuration errors
  • Software‑Only Configuration: Simplifies setup via PACSystems programming tools for faster deployment
  • Scalable I/O Capacity: 18 slots support up to 15 single‑width or 8 dual‑width modules for medium‑to‑large control systems
  • Dedicated Power Slot: Slot 0 for high‑power RX7i supplies ensures stable power to all modules
  • Backward Compatibility: Supports Series 90‑70 I/O for seamless legacy system integration
  • Process Automation: Expands I/O for RX7i PACs in oil/gas, chemical, power generation, and water/wastewater plants
  • Manufacturing Control: Houses I/O modules for automotive, packaging, and material handling lines with high throughput needs
  • Large‑Scale I/O Systems: 18‑slot capacity supports extensive I/O counts in complex industrial processes
  • Legacy System Upgrades: Integrates Series 90‑70 I/O with new RX7i CPUs during plant modernization
  • High‑Speed Data Acquisition: 4x VME bandwidth delivers rapid I/O transfer for real‑time monitoring and control
  • Modular Control Architectures: Wall‑mount design suits distributed I/O in factory floors and remote industrial sites
  • Redundant Power Configurations: Works with dual RX7i power supplies to maximize system availability in critical applications
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