GE IC693TCM302B

Product Introduction

The IC693TCM302B is an 8-channel temperature control module for the GE Fanuc Series 90-30 PLC system, managing eight independent temperature zones with thermocouple/RTD inputs and PWM discrete outputs. It supports open-loop manual control and closed-loop auto PID control, delivering ±1°C temperature accuracy and 12-bit (0.2°C) resolution. Revision B enhances temperature range and diagnostic capabilities, integrating seamlessly with Series 90-30 PLCs to simplify complex industrial temperature regulation. It features open thermocouple/reverse connection detection, out-of-tolerance monitoring, and programmable PWM outputs (0.1–60 seconds) for precise heating/cooling control, serving as a high-performance solution for multi-zone temperature management in industrial automation.
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Description

Technical Specifications

Parameter Details
Module Type 8-Channel Temperature Control Module (Series 90-30, Revision B)
Input Channels 8 thermocouple (J, K, L) or RTD channels; 1 RTD compensation channel
Input Resolution 12 bits (0.2°C)
Input Accuracy ±1°C with automatic calibration
Thermocouple Compatibility J, K, L types; max impedance 30 Ω
Common Mode Voltage ±12 VDC
Output Channels 8 discrete PWM outputs for heating/cooling control
Output Voltage Range 18–30 VDC
Output Load Current 100 mA per channel; max off-state leakage 0.1 mA
PWM Output Range 0.1–60 seconds, 0.1% resolution
Internal Power Consumption 150 mA at +5 VDC
Overload Threshold 700 mA typical, 2 ms minimum
Operating Temperature 0°C – 55°C (storage: -40°C – +85°C)
Humidity 5% – 95% (non-condensing)
Dimensions 3.6×13×13.5 cm
Weight 0.5 kg
Indicators LEDs for power, channel status, and fault alarms
Compatibility All Series 90-30 CPU models and baseplates

Function Features

  1. 8 Independent Temperature Zones: Controls eight separate zones with dedicated inputs/outputs for flexible multi-zone management.
  2. Thermocouple/RTD Support: Accepts J/K/L thermocouples and RTDs for versatile temperature sensing in industrial environments.
  3. Manual/Auto Control Modes: Open-loop manual mode for direct actuation; closed-loop auto mode with PID for precise temperature regulation.
  4. High Precision & Resolution: ±1°C accuracy and 12-bit (0.2°C) resolution ensure stable control in critical processes.
  5. Advanced Diagnostics: Detects open thermocouples, reverse connections, and out-of-tolerance readings, with LED indicators for quick troubleshooting.
  6. Programmable PWM Outputs: 0.1–60 second range enables proportional control of heaters/coolers for smooth temperature adjustments.
  7. Automatic Calibration: Maintains ±1°C accuracy over time without manual intervention.
  8. Common Mode Noise Rejection: ±12 V common mode voltage capability resists electrical interference in harsh industrial settings.
  9. Seamless PLC Integration: Communicates with Series 90-30 CPUs for centralized monitoring and control via backplane bus.
  10. Revision B Enhancements: Improved resolution, expanded temperature range, and enhanced diagnostics for demanding applications.

Application Scenarios

  • Industrial Oven & Furnace Control: Manages eight heating zones in metal heat treatment, ceramic sintering, and plastic molding ovens, using PID control for uniform temperature profiles.
  • Food & Beverage Processing: Controls temperature in pasteurization, fermentation, and baking lines, ensuring compliance with safety standards via precise monitoring and PWM output control.
  • Semiconductor Manufacturing: Regulates wafer processing equipment (etching, deposition) with ±1°C accuracy and RTD compensation for consistent production quality.
  • Pharmaceutical Production: Maintains critical temperatures in reactors, lyophilizers, and clean rooms, using diagnostics to prevent batch errors from sensor faults.
  • HVAC & Building Automation: Controls multiple zones in data centers, hospitals, and industrial facilities, optimizing energy use with proportional PWM output control.
  • Test & Measurement Systems: Provides stable temperature control for environmental chambers, material testing rigs, and electronic component burn-in setups, leveraging high resolution for test accuracy.
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