GE IC693CHS397 Modular CPU Backplane - Image 1
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GE IC693CHS397 Modular CPU Backplane
GE IC693CHS397 Modular CPU Backplane - Image 2
GE IC693CHS391 Modular CPU Backplane
GE IC693CHS391 Modular CPU Backplane
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GE Hydran M2 Transformer Monitoring Device
GE Hydran M2 Transformer Monitoring Device

GE IC693CHS397 Modular CPU Backplane

Technical Specifications

  • Number of Slots: Five slots for installing I/O modules, one dedicated slot for the power supply module on the far left, and one expansion port.
  • Power Supply: The power slot on the left side requires a dedicated power module. The rated current is 170 mA at 5 VDC.
  • Expansion Capability: Can be connected to additional expansion baseplates through the 25-pin D-type female expansion connector on the right side, with a maximum cable length of 50 feet (15 meters).
  • Compatibility: Supports various GE Series 90-30 I/O modules and special-purpose modules. The number of expandable baseplates depends on the CPU type (e.g., up to four baseplates with CPU 331, 340, and 341, or up to seven baseplates with CPU 350 and above).
Category:
Description
  • Physical Dimensions: Approximately 10.43 x 5.12 x 5.59 inches (width x height x depth).
  • Operating Temperature: -20°C to 60°C (extended range optional).
  • Storage Temperature: -40°C to 85°C.
  • Environmental Conditions: Suitable for industrial environments with humidity levels up to 95% (non-condensing).

Functional Features

  • Modular Design: The IC693CHS397 features a modular design with multiple slots, allowing for easy expansion and customization of the PLC system based on specific application requirements.
  • High Reliability: Built to industrial standards, the backplane ensures stable and reliable operation in harsh industrial environments.
  • Flexible Configuration: Supports various combinations of CPU modules, I/O modules, and other devices, providing flexibility in system design.
  • Easy Maintenance: The modular design facilitates quick installation and replacement of modules, reducing maintenance time and costs.
  • Redundancy Support: When used with specific CPU modules and software configurations, the IC693CHS397 can support redundancy systems, enhancing system availability and fault tolerance.
  • Isolation Protection: Provides channel-to-channel and channel-to-bus isolation rated at 1500 VAC, ensuring system stability and protecting against electrical noise.

Application Scenarios

  • Manufacturing Automation: In manufacturing plants, the IC693CHS397 can be used to expand the PLC system, connecting a large number of I/O modules to control and monitor various production processes, such as assembly lines, packaging machines, and material handling systems.
  • Energy Management: In power generation and distribution systems, the backplane can integrate multiple I/O modules to monitor and control grid operations, ensuring stable power supply and optimizing energy usage.
  • Water and Wastewater Treatment: The IC693CHS397 can connect sensors and actuators in water treatment processes, enabling precise control of chemical dosing, water distribution, and wastewater treatment operations.
  • Process Control: In chemical, petrochemical, and pharmaceutical plants, the backplane supports the integration of numerous process control devices, such as pressure transmitters, temperature sensors, and flow meters, ensuring accurate process control and product quality.
  • Building Automation: In smart buildings, the IC693CHS397 can connect lighting control, HVAC, and security systems, enabling centralized management and intelligent control of building facilities.
  • Transportation Systems: In rail transportation, the backplane can integrate signaling systems and train control devices, ensuring safe and efficient rail operations.
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